Modeling Image Formation in Layered Structures: Application to X-ray Lithography

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In the fabrication of semiconductor devices using lithography, the modeling of the exposure process is very often needed. The elements of a typical exposure system from a modeling perspective comprise of a radiation source, a patterned mask and a wafer coated with a photo-resist. The diffracted image of the mask pattern exposes the photo-resist after propagating through a distance termed mask-to-lvafer gap. The exposed wafer is later on chemically developed to form a semiconductor device. In short, the electric field propagates through a series of regions (layers) with various materials and topographies (structures) before forming an image on the wafer. In this paper we describe a computational algorithm based on angular spectrum propagation approach to model image formation in layered structures with particular emphasis to X-ray Lithography (XRL). Several illustrative examples will be presented.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 53 - 58
Industry sector: Sensors, MEMS, Electronics
Topics: Informatics, Modeling & Simulation, Modeling & Simulation of Microsystems
ISBN: 0-96661-35-0-3