TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomePapers

Archives: Papers

TechConnect Proceedings Papers

Modeling of Piezoelectric MEMS Using the Finite Cloud Method

Ohs R.R., Aluru N.R., University of Illinois, US
In this paper we present a meshless based Finite Cloud Method (FCM) for the numerical solution of partial differential equations (PDEs) governing piezoelectricity. Using a point distribution, FCM constructs interpolation functions without assuming any connectivity [...]

Compact Modeling of Bistable Electrostatic Actuators

Xu J., Darling R.B., Lauritzen P.O., University of Washington, US
A compact circuit simulation model for a bistable electrostatic cantilever actuator is presented which is appropriate for circuit and system simulation of RF MEMS switches. This simplified model captures the essential physical features of a [...]

A Compact Model for an IC Lateral Diffused MOSFET Using the Lumped-Charge Methodology

Subramanian Y., Lauritzen P.O., Green K.R., Texas Instruments, US
A compact model for an IC Lateral Diffused MOSFET is developed using the Lumped-Charge Methodology[1]. Model equations and key performance characteristics are documented. They satisfy the requirements of Power MOSFET models[2], unlike the competitive macromodels [...]

Parameterized Electrostatic Gap Model for Structured Design of Microelectroelectrical Systems

Lu M.S., Fedder G.K., Carnegie Mellon University, US
VLSI system designers can begin their design process with a behavrioal description of a system, then proceed to physical design. MEMS designers typiclly begin with device design, this process is opten followed by several fabrication [...]

Model Based Identification as a New Tool to Extract Physical Parameters of Microactuators from Measurements with Error Bounds

Rembe C., Hofer E.P., Tibken B., University of Ulm, DE
Model based evaluation of high speed cinematographic image sequences is demonstrated for a microrelay which was manufactured using the LIGA technology. The measurements of the microrelay have been performed with an experimental setup based on [...]

A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices

Nguyen L., Lee H.J., Maher M.A., von Sosen H., Tanner Research, Inc., US
A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices Categories: Co-simulation and Optimization System, Multi-level Modeling Linh Nguyen, Hee Jung Lee, Mary Ann Maher, and Harald von Sosen Tanner Research, Inc. VLSI [...]

Electro-Mechanical Transducer for MEMS Analysis in ANSYS

Gyimesi M., Ostergaard D., ANSYS, Inc., US
The paper introduces an electro-mechanical transducer finite element (EMT) for the strongly coupled simulation of micro electro-mechanical system (MEMS) devices in the commercial finite element analysis (FEA) package ANSYS.

Analytical Modeling of Beam Behavior Under Different Actuations

Sarraute E., Dufour I., URA CNRS 1375, FR
The aim of this paper is to establish simple analytical equations of the beam deflection for different actuation methods (magnetic with current, magnetic with magnet, electrostatic and piezoelectric). The analytical formulae are obtained from the [...]

A Model of Photoelectric Phenomena in MOS Structures at Low Electric Fields

Przewlocki H.M., Institute of Electron Technology, PL
This paper presents a new model of photoelectric phenomena taking place in MOS structures at low electric fields in the dielectric. Solutions of models equations are analyzed and discussed. Using these equations various photoelectric characteristics [...]

Relaxation-based Circuit Simulation for Large-scale Circuits with Lossy Transmission Lines

Chen C-J., Chinese Culture University, TW
This paper integrates a time-domain transmission line calculation method and relaxation-based circuit dimulation algoright, and investigates the transient response simulation of large-scale circuits with transmission lines. Experimental results have been provided to justify the performance [...]

Posts pagination

« 1 … 1,040 1,041 1,042 … 1,060 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.