thermal simulation – TechConnect Briefs

Positioning of Thermal Via Regions for Reducing Hotspot Temperature in 3D ICs

Maj C., Galicia M., Zajac P., Napieralski A., Lodz University of Technology, PL

The increase of the processor performance is the most desired result of technology evolution. As today’s technology reaches its limits, some other methods has to be developed to uphold performance increase. One of the promising [...]

Thermal Coupling in Technologies Based on Tri-gate Transistors

Janicki M., Zajac P., Szermer M., Napieralski A., Lodz University of Technology, PL

This paper presents the analyses of static and dynamic thermal coupling among microsystem components for technologies based on tri-gate transistors. Simulations were carried out using Green’s function thermal solver based on power trace data computed [...]

FEM study of a 3-axis thermal accelerometer based on free convection in a microcavity

Nguyen H.B., Mailly F., Latorre L., Nouet P., University Montpellier 2 / CNRS - LIRMM, FR

Thermal convective accelerometers are based on heat transfer in a sealed cavity filled with a fluid. The principle was patented in the 40’s and the first implementations on silicon, obtained with bulk micromachining, were reported [...]

SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction

Székely V., Páhi A., Rosenthal M., Rencz M., Techical Unviersity of Budapest, HU

The paper presents the new features of the SUNRED field solver program: the visualization of the structures in the 3D version, and the new dynamic simulation methods. Comparisons with other field solvers demonstrate the superior [...]