Thermal convective accelerometers are based on heat transfer in a sealed cavity filled with a fluid. The principle was patented in the 40’s and the first implementations on silicon, obtained with bulk micromachining, were reported in 1997-98. Since that time, many single and 2-axis sensors were reported in the literature but not 3-axis device based on a standard technology. Therefore, the goal of this study is to demonstrate the feasibility of a simple third sensitive axis and provide the MEMS designer with a compact model and the main parameters that govern the sensitivity.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: June 18, 2012
Pages: 621 - 624
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topics: Informatics, Modeling & Simulation