Interconnect – Page 2 – TechConnect Briefs

Three-Dimensional Effects Obtained from Capacitance Analysis of an SRAM Cell

Takemura Y., Osada K., Yagyu M., Yamaguchi K., Ushio J., Maruizumi T., Hitachi Ltd., JP

Employing Green's function method, we analyzed the 3D capacitance for the hole interconnect structure in an SRAM cell. We found novel 3D effects as follows; (1) via connection increases the capacitance of parallel lines, (2) [...]

Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures

Balk I., He Y., IntelliSense Corporation, US

Progress in MEMS and packaging design has made significant changes in the requirements for modeling tools. In order to design a modern microdevice or interconnect system it is no longer sufficient to limit the analysis [...]

A Methodology for Modeling a Complex Geometry on Wafer from a Layout Data

Yoon S., Kwon O., Won T., Inha University, KR

This paper reports a novel methodology and its application to the modeling of a complex 3D geometry on wafer from a layout data. Our modeling method comprises the steps of: drawing a mask layout; transforming [...]

Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells

Hieke A., Infineon Technologies Corporation, US

A fundamental proble of all FEM capacitance computations in MEMS and ULSI is to determine proper mesh size for the elements representing the considered model. In particular, opticaml mesh size selection is crucial for large [...]

Pre-Physical Design Analysis and Optimization of Repeaters Based on Technology Node, Materials, Devices, and Repeater Options

Lynch W.T., Independent Consultant, US

For the first time a comprehensive methodology has been applied to the pre-physical design of hierarchical interconnect wiring with consideration of the limitations of both the device and the wiring technologies (Fig. 1). The overall [...]

Simple ADPL Implementation of a 3D FEM Simulator for Mutual Capacitances of Arbitrarily Shaped Objects Like Interconnects

Hieke A., Siemens Microelectronics, US

This paper describes the implementation of an ANSYS Parametric Design Language (APDF) macro called CACACO for the computation of capacitance matrixes of arbitrarily shaped 3D objects in arbitrarily distributed dielectrics via the conservation of field [...]