TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsalignment

Keywords: alignment

Effect of CNT Morphology and Alignment on the Interfacial and the Elastic Properties of Nanocomposites

Alian A.R., Meguid S.A., University of Toronto, CA
Carbon nanotubes (CNTs) are typically curved, agglomerated and aggregated as a result of van der Waal interactions and electrostatic forces. It has been proven experimentally that CNT morphology and alignment affect the mechanical, electrical, and [...]

High-Density Carbon Nanostructured Papers with Superior Conductive and Mechanical Properties

Younes H., Abu Al-Rub R., M. Rahman Md., Dalaq A., Al Ghaferi A., Masdar, AE
The randomly oriented carbon nanotubes have exhibited substantially lower electrical and thermal conductivities than anticipated. In this work high density CNS-based BPs have been fabricated successfully using aligned carbon nanostructure and the anionic surfactant NaDDBS. [...]

Characterization of Screen-Penetrating Aerosol Fibers and Their Alignment in an Electric Field

Ku B.K., Deye G., Turkevich L.A., NIOSH, US
Length classification of airborne fibers, including carbon nanotubes/nanofibers, is a fundamental technology important for toxicology studies of these materials. Fiber toxicity appears to depend on fiber concentration, dimensions (diameter and length) and durability in the [...]

Alignment of Different Functional Single Wall Carbon Nanotubes using Fe2O3 Nanoparticles under External Magnetic Field

Younes H., Hong H., South Dakota School of Mines and Technology, US
In this work we describe a new approach to align functionalized single walled carbon nanotubes (SWNTs) by γ-Fe2O3 in the presence of an external magnetic field without using chemical surfactant. Five different functionalized SWNTs are [...]

A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material

Lee S.S., Kondo M., Ishibashi R., Kinoshita K., Kishida S., Tottori University, JP
In this paper we have firstly reported that a novel method to maintain alignment accuracy in wafer bonding process utilizing resin as an adhesive material. We have proposed tentatively localized bonding method with 1100 nm [...]

Mechanical Reinforcement of Epoxy Resins using Magnetic Aligned Halloysite

Mendoza-Bello S., Barrientos-Ramirez S., Montes de Oca G., Flores-Santos L., Macro-M, S.A. de C.V., MX
In this work we report the synthesis of magnetite nanoparticles using halloysite as template. Halloysite is treated using a two steps activation method (Sn/Pd) and in a third step ferrite is formed using a coprecipitation [...]

Alignment of Si3N4 nanorods in Polypropylene single fibers

Rangari V.K., Yousuf M., Jeelani S., Tuskegee University, US
We have successfully aligned the silicon nitride nanorods in polypropylene single filaments through melt extrusion process. Significant enhancement in tensile properties has been observed for 1wt% rod shaped Si3N4 particles. The tensile results clearly show [...]

Large area, directionally aligned single-walled carbon nanotube thin film by self-assembly and compressed sliding methods

Najeeb C.K., Lee J-H., Chang J., Kim J.H., Ajou University, KR
To fabricate large area directional arrangement of SWNTs, we employed two different methods such as self assembly of surface modified SWNTs by drop casting or spin coating and by compressed sliding of SWNT dispersion between [...]

Silicon die self-alignment on a wafer: stable and instable modes

Berthier J., Grossi F., Di Cioccio L., CEA/LETI/MINATEC, FR
To create advanced Microsystems by 3D integration, die-to-wafer assembly is required to obtain fast and reliable packaging. In order to overcome the main difficulties of current techniques, self-assembly methods are promising due to their serial [...]

Analysis of the Liquid Mediated Friction during Alignment in NIL Process

Kang S-H, Park S.H., Lee W.I., Seoul National University, KR
When Nano-Imprint Lithography (NIL) process is adopted in the large area applications like display, the stiction phenomenon which is the adhesion or in-plane friction between mold and substrate to disturb fine alignment process can be [...]

Posts pagination

1 2 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.