TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsYoshida T.

Authors: Yoshida T.

HiSIM-SOI: SOI-MOSFET Model for Circuit Simulation Valid also for Device Optimization

Sadachika N., Kusu S., Ishimura K., Murakami T., Kajiwara T., Hayashi T., Nishikawa Y., Yoshida T., Miura-Mattausch M., Hiroshima University, JP
SOI-MOSFETs are considered to be suitable for high performance as well as low power applications and its developments are tend to go toward the thinner SOI films to enhance the device characteristics. Thus compact models [...]

Millimeter long vertically aligned single-walled carbon nanotubes by an ultra long lifetime of catalysts

Iwasaki T., Zhong G., Yoshida T., Aikawa T., Morikane R., Kawarada H., Waseda University, JP
Controlling the growth direction of SWNTs on a substrate is one of the most important issues for fabrication of SWNT-based applications, such as field effect transistors (FETs) and interconnects for LSI. We have succeeded in [...]

Biomimetic Design of a Microfluidic Device for Auto-separation of Leukocytes from Whole Blood

Shevkoplyas S.S., Yoshida T., Munn L.L., Bitensky M.W., Boston University, US
Leukocytes comprise less than one percent of all blood cells. Enrichment of their number, starting from a sample of whole blood, is the required first step of many clinical and basic research assays. We created [...]

Surface Modification of Al203 Fiber with Nanoparticles Using a Dry Mechanical Coating Technique

Coowanitwong N., Wu C-Y, Nguyen J., Cai M., Ruthkosky M., Rogers J., Feng L., Watano S., Yoshida T., University of Florida, US
Nanoparticles are of great interest to many industries due to their unique properties. One of the well-known properties is high surface area, which is critically essential to enhancing performance activity [1] and greatly vital to [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.