Wachutka G. – Page 3 – TechConnect Briefs

Compact MEMS Modeling for Design Studies

Voigt P., Wachutka G., University of Technology, DE

A method for MEMS macromodel development is presented which is based on a physical device description to obrain mathematical relations for the device operation. Since design and technlogy parameters are input parameters of the resulting [...]

Simulation of Orientation-Dependent Etching of Silicon Using a New Step Flow Model of 3D Structuring

Horn A., Schröder H., Obermeier E., Wachutka G., Münich University of Technology, DE

We present a new model of three-dimensional orientation-dependent etching of Si{100}. Recent experimental results suggest to conceive etching as a “peeling” process of terraced planes, leading to the concept of a “step flow model of [...]

Physically Rigorous Modeling of Sensing Techniques Exploiting the Thermo-Optical and Electro-Optical Effect

Thalhammer R., Hille F., Scheubert P., Wachutka G., Münich University of Technology, DE

The complex refractive index in semiconductors depends on several electrical, thermal, and mechanical state variables, e. g. carrier concentrations, lattice temperature, or mechanical stress. Making use of these dependencies, various internal laser probing techniques and [...]

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

Ramminger S., Mitic G., Türkes P., Wachutka G., Siemens AG, DE

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of [...]

Analysis of Unstable Behavior Occurring in Electro-Mechanical Microdevices

König E-R, Wachutka G., Münich University of Technology, DE

We analyze the instability which is inherent to electrostatically driven microdevices. Further, we propose a homotopy method to overcome this difficulty during simulation of these devices. Starting from a simplified model, the governing differential equations [...]

Transient Electromagnetic Behaviour of Multiply Contacted Interconnects

Böhm P., Wachutka G., Münich University of Technology, DE

This paper presents a methodology for the analysis of the transient electromagnetic behavior of multiply contacted interconnects. It is shown that for applications with high switching frequencies and high pulse repetition rates with subsequent steep [...]

The Art of Modeling Coupled-Field Effects in Microdevices and Microsystems

Wachutka G., Münich University of Technology, DE

The rapid progress in microsystems technology is increasingly supported by MEMS-specific modeling methodologies and dedicated simulation tools. These do not only allow the visualization of fabrication processes and operational principles, but they also assist the [...]

Modeling Strategies for Microsystems

Voigt P., Schrag G., König E-R, Wachutka G., Technical University of Münich, DE

A hierarchical approach to microsystem modeling is outlined. On the device level, the operating behavior is analyzed on the basis of continuous field models To deal with the coupling effects typical of microsystems, various coupling [...]

Validation and Calibration of Electrothermal Device Models Using Infrared Laser Probing Techniques

Thalhammer R., Fürböck C., Seliger N., Gornik E., Wachutka G., Technical University of Münich, DE

As it has recently been demonstrated, the internal distribution of carrier concentration and temperature is accessible to accurate measurements by various infrared laser probing techniques. In this work we present an advanced method for the [...]