Wachutka G. – Page 2 – TechConnect Briefs

Mixed-Level Model for Highly Perforated Torsional Actuators Coupling the Mechanical, the Electrostatic and the Fluidic Domain

Sattler R., Schrag G., Wachutka G., Institute for Physics of Electrotechnology, DE

Electrostatic attraction between neighboring electrodes is a widely used actuation principle employed in tiltable micromirrors or microrelays. Electrostatic actuation is especially favored for switching applications in mobile telecommunication because of its low power consumption. State-of-the-art [...]

Mixed-Level Model for Highly Perforated Torsional Actuators Coupling the Mechanical, the Electrostatic and the Fluidic Domain

Sattler R., Schrag G., Wachutka G., Institute for Physics of Electrotechnology, DE

Electrostatic attraction between neighboring electrodes is a widely used actuation principle employed in tiltable micromirrors or microrelays. Electrostatic actuation is especially favored for switching applications in mobile telecommunication because of its low power consumption. State-of-the-art [...]

Compact Thermal Model for Transient Temperature Fields in Electronic Systems

Gerstenmaier Y.C., Wachutka G., Münich University of Technology, DE

A thermal model is presented, which describes the evolution of the temperature distribution in electronic systems. Introducing a set of deliberately chosen effective time constants, the time dependence is given by convolution integrals with the [...]

Evaluation of the Breakdown Behavior of 4H-SiC Schottky Diodes with a p-Guardring Junction Termination

Felsl H.P., Wachutka G., Münich University of Technology, DE

We have investigated the reverse behavior of 4H Silicon Carbide (SiC) Schottky diodes with a p-guardring junction termination. The breakdown behavior was analyzed with respect to the doping concentration of the epi-layer underneath the Schottky [...]

Simulation of Electrical Field Induced Particle Transfer

Hoffmann R., Wachutka G., Océ Printing Systems, DE

The controlled transfer of charged, densely distributed polymer particles across narrow air gaps is one of the basic mechanisms in modern printing technology. To understand the detachment and transport of charged particles by an electric [...]

Physically-Based Damping Model for Highly Perforated and Largely Deflected Torsional Actuators

Sattler R., Schrag G., Wachutka G., Münich University of Technology, DE

We propose a mixed level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which enables the inclusion of damping effects in system level models of entire microsystems in a natural, physical-based, and flexible [...]

Squeeze Film Damping in Arbitrary Shaped Microdevices Modelled by an Accurate Mixed Level Scheme

Schrag G., Voigt P., Wachutka G., Münich University of Technology, DE

We propose a mixed level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which allows for including the damping effects in system-level models of entire microsystems in a natural physical-based way. It also [...]

Boundary Independent Exact Thermal Model for Electronic Systems

Gerstenmaier Y.C., Pape H., Wachutka G., Siemens AG, Corporate Technology, DE

A compact thermal model is presented, which describes the hot spot (junction) temperatures and contact heat flows of electronic packages or systems in the stationary state. The model is exact provided that the underlying heat [...]

Investigation of Cross-Coupling and Parasitic Effects in Microelectromechanical Devices on Device and System Level

Schrag G., Zelder G., Wachutka G., Münich University of Technology, DE

With progressing monolithic integration of entire micro-electromechanical systems on one chip fabricated by standard IC technology we have to cope with the problem that the operation of embedded transducer elements is considerably affected by cross-coupling [...]

Methodology of Macromodeling Demonstrated on Force Feedback S/D-Architectures

Hardtmann M., Aigner R., Nadal R., Wachutka G., Münich University of Technology, DE

Design and verification of complete microsystems require effective models of the micromechanical components for the simulation at system level. Particularly for force feedback S/D-architectures, long transient simulations are inevitable to characterize the system-inherent signal pro-cessing. [...]