TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsLee J.

Authors: Lee J.

Effects of the Shape of Nanoparticles on the Crystallization Behavior of Poly(ethylene terephthalate) Nanocomposites in the Flow Fields

Kim B.C., Jang K.H., Hahm W.G., Kikutani T., Lee J., Hanyang University, KR
This paper investigated the effects of the shape of nanoparticles on the crystallization behavior of high molecular weight poly(ethylene terephthalate) (PET ; inherent viscosity of 0.98 g/dl) in the shear and elongational flow fields. Two [...]

Periodic Nanowell Array using Template-Assisted Nanosphere Lithography

Jung S., Lee J., Seoul National University, KR
This paper presents a template-assisted nanosphere lithography(NSL) to obtain high-quality crystal in regularity and coverage(Figure 1). A periodic array of 100-nm deep, 360-450 nm wide nano-trenches was fabricated by nano imprint lithography(NIL), and used as [...]

FEM Simulation for demolding process in thermal imprint lithography

Song Z., Lee J., Park S., Louisiana State University, US
Thermal imprint lithography is a highly potential technique utilizing molding to produce micro- and nano-structures with high throughput and at low cost. Extensive researches have been performed in understanding polymer flow behavior and cavity filling [...]

Active Sealing for Soft Poymer Microchips

Bang H., Lee J., Lee W.G., Park J., Yun H., Lee J., Lee W.G., Chung C., Chung S., Cho K., Chung C., Chung S., Han D-C, Chang J.K., Seoul National University, KR
This paper presents a universal sealing method for soft polymer (elastomer) microchips. A robust and reversible sealing method which allows various materials to be bonded and sealed tightly with each other even in aqueous solutions, [...]

Processing Parameters Affecting Nanoinjection Molding

Srirojpinyo C., Yoon S-H, Lee J., Sung C., Mead J.L., Barry C.M.F., University of Massachusetts-Lowell, US
Although micro parts and features are routinely molded, the performance of polymer melts is not well understood when the part wall thickness is less than 1 mm. In this study, the effects of molding conditions [...]

Investigation of Tooling Surfaces on Injection Molded Nanoscale Features

Yoon S-H, Srirojpinyo C., Lee J., Sung C., Mead J.L., Barry C.M.F., University of Massachusetts at Lowell, US
The composition and surface properties of tooling materials become more critical as the size of the molded features decreases [1, 2]. This work investigates the effect of tooling surfaces with micro and nanoscale features. These [...]

Numerical Simulations of Novel Constant-Charge Biasing Method for Capacitive RF MEMS Switch

Lee J., Goldsmith C., University of Texas at Dallas, US
In the capacitive RF MEMS SW, it has been shown that every 5V of increased actuation voltage decreases the lifetime by an order of magnitude. In this paper, a novel method for automatically controlling the [...]

Design Optimization of Micromachined High Aspect Ratio 3D On-Chip Solenoid Inductor

Chomnawang N., Lu H., Colinjivadi K., Lee J., University of Texas at Dallas, US
We report the simulation work done by using Sonnet EMÔ on high aspect ratio (1:4 and 1:8) 3D on-chip air-core solenoid inductors. Simulations on 2, 3, and 5-turn inductors with 200 and 400 mm high [...]

RF-MEMS Voltage Tunable Capacitor using Electrostatic Forces

Lee J., Kim Y., Na D., Park S., Kyungpook National University, KR
In this paper, we have proposed a fabrication method of a RF-MEMS voltage tunable capacitor using Au-electroplating technique, which has one movable parallel plate with various structure of beams. We applied an electrostatic method and [...]

Optical Characteristics of InAs Quantum Dots influenced by AlGaAs/GaAs Superlattice Barriers

Choi H., Jeong Y., Park Y., Lee J., Leem J-Y, Leem J-Y, Jeon M., Jeong Y., Inje University, KR
We investigated the effect of AlGaAs/GaAs superlattice barriers on the optical properties of InAs quantum dots (QDs) by using photoluminescence (PL) spectroscopy. The samples used in the present work were grown by molecular beam epitaxy [...]

Posts pagination

« 1 2 3 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.