Husak M. – Page 2 – TechConnect Briefs

MEMS Humidity Structure with Cantilever – Simulation of Behaviour

Suchanek P., Husak M., Czech Technical University in Prague, CZ

The aim of this paper is to report the design of the simple polymers structure humidity sensors and its mechanical and piezorezistive simulation in CoventorWare. Acquired simulation data gets a primary image about sizes bend [...]

Design and Characterization of new GaAs Micromechanical Thermal Converter developed for Microwave Power Sensor

Jakovenko J., Husak M., Lalinsky T., Czech Technical University in Prague, Faculty of Electrical Engineering, CZ

In this report we demonstrate the design of new GaAs based Micromechanical thermal converter (MTC) that creates heart of the RF power sensor microsystem. Transmitted power is the main quantity measured in RF systems. The [...]

Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix

Husak M., Boura A., Jakovenko J., Czech Technical University in Prague, CZ

In the article there is presented a new arrangement of a temperature sensor system for air velocity and direction measurement. The system utilizes temperature dependence of the current through the channel of MOS structure. The [...]

Optimization of GaAs MEMS structures for Microwave Power Sensor

Jakovenko J., Husak M., Lalinsky T., Czech Technical University in Prague, CZ

This work discusses the thermo mechanical simulations performed with the aim to optimise the temperature distribution of the Microwave Power Sensor (MPS) microsystem keeping the thermal stress as low as possible. The concept of the [...]

The Design of Temperature Matrix with Direction Sensitivity

Husak M., Jakovenko J., Kulha P., Janicek V., Czech Technical University in Prague, CZ

There has been designed a matrix of four temperature sensors on a chip. Each temperature sensor is composed of 9 NMOS transistors for increasing temperature sensitivity. The matrix is designed for anemometric measurement of velocity [...]

Macromodel of Intelligent Sensor Structure with Accelometer

Husak M., Jakovenko J., Kulha P., Novak J., Janicek V., Czech Technical University in Prague, CZ

The paper describes conceptual approach to the design of a tilt structure determined for integration on a chip. An accelerometer for measurement of inclination in x and y axes is used as a sensor. There [...]

Modelling and Simulation of Mechanical, Thermal and Electrical Behaviour of Si Cantilever with Implanted Strain Gauge

Husak M., Jakovenko J., Kulha P., Vborn Z., Czech Technical University in Prague, CZ

The paper describes methodology of design of cantilever with implanted layers in Si monocrystal. In the paper there is characterized physical model of implanted strain gauges, various girder topologies are designed and basic technological steps [...]

Design and Simulation of the GaAs Micromechanical Thermal Converter for Microwave Transmitted Power Sensor

Jakovenko J., Husak M., Burian E., Lalinsky T., Czech Technical University, CZ

In this project we discuss the thermomechanical simulations performed in the aim of optimising the GaAs based Micromechanical Thermal Converter that creates heart of Microwave Transmitted power sensor. Conception of the absorbed power measurement is [...]

Microsystem Modeling – from Macromodels to Microsystem Design

Husak M., University of Prague, CZ

The paper presents ideas about possible approaches to development of microsystem models. From the general point of view, microsystem (MST) is considered as a system dealing with non-electrical quantities from all energy domains of real [...]

Concept of an Intelligent Microsystem Structure for Communication with Real Surrounding Space

Husak M., Jakovenko J., Czech Technical University, CZ

In the paper, concept of intelligent microsystem structure is presented. This concept is applicable in general surrounding environment. Concrete model of an intelligent temperature microsystem for control purposes is designed. Microsystem function has been verified [...]