Antoniadis D. – TechConnect Briefs

Hybrid Process Design Kit: Single-Chip Monolithic III-V/Si Cascode GaN-HEMT

Antoniadis D., Chiah S.B., Fitzgerald E.A., Lee K.E.K., Zhou X., Nanyang Technological University, SG

In this paper, we present the design of a cascode GaN-HEMT (CGH) structure in the monolithic integration of III-V/Si fabrication platform to fabricate monolithic III-V/Si CGH structures on a single chip by using hybrid process [...]

A Hybrid Process Design Kit: Towards Integrating CMOS and III-V Devices

Antoniadis D., Chiah S.B., Fitzgerald E.A., Lee K.E.K., Ng C.Y., Zhou X., Nanyang Technological University, SG

A hybrid process design kit (PDK) for novel integrated circuits incorporating high performance compound semiconductor materials and devices into existing production Si-CMOS compatible foundry process is presented. The hybrid PDK permits direct integration of Au-free [...]