Technical University of Lodz – TechConnect Briefs

The growth of a polycrystalline graphene from a liquid phase

Kula P., Pietrasik R., Dybowski K., Atraszkiewicz R., Kaczmarek L., Kazimierski D., Niedzielski P., Modrzyk W., Technical University of Lodz, PL

The novelty of the presented paper is the mechanism of graphene growth from the liquid phase on the Cu-Ni alloy and the type of atmosphere, which was used in the graphene fabrication - acetylene, ethylene, [...]

Boundary Condition Independence of Cauer RC Ladder Compact Thermal Models

Janicki M., Torzewicz T., Kulesza Z., Napieralski A., Technical University of Lodz, PL

This paper presents a methodology to create compact thermal models of electronic systems. The models have a form of Cauer RC ladders and the values of their elements can be attributed physical significance. The methodology [...]

Novel Structure of CMOS Voltage-to-Current Converter for High-Voltage Applications

Jankowski M., Napieralski A., Technical University of Lodz, PL

The research presented in this paper is focused on combining voltage-based and current-based modes of high-voltage analog signal processing. The research originated from necessity of interfacing a large current-mode processing module inside voltage-mode integrated circuit. [...]

High-Voltage High Input Impedance Unity-Gain Voltage Buffer

Jankowski M., Napieralski A., Technical University of Lodz, PL

The research presented in this paper is targeted to devise possibly non-complex high-voltage unity-gain buffer well suited for connecting to outputs of current-mode stages. The circuit idea originated from need of buffering a high-voltage current-mode [...]

Design of ASIC Dedicated to Thermal Analysis of Many-Core Architectures

Szermer M., Kotynia L., Pietrzak P., Janicki M., Napieralski A., Technical University of Lodz, PL

The main goal of the paper is to present the design of an ASIC dedicated to thermal analysis of many-core architectures. Due to the fact that the process of designing real multi-core microprocessors is expensive [...]

The Application of RESCUER Software to Modelling of Coupled Problems in Modern Devices

Zubert M., Napieralski A., Technical University of Lodz, PL

The simulation of modern electronic devices requiring taking into account physical phenomena of different nature such as electrical, mechanical, thermal or fluidic ones. The most of processes are governed by multidimensional partial differentialalgebraic equations (PDAEs). [...]

Affiliations: Technical University of Lodz

The growth of a polycrystalline graphene from a liquid phase

Boundary Condition Independence of Cauer RC Ladder Compact Thermal Models

Novel Structure of CMOS Voltage-to-Current Converter for High-Voltage Applications

High-Voltage High Input Impedance Unity-Gain Voltage Buffer

Design of ASIC Dedicated to Thermal Analysis of Many-Core Architectures

The Application of RESCUER Software to Modelling of Coupled Problems in Modern Devices

The accurate Electro-Thermal Model of Merged SiC PiN Schottky Diodes

SC Cavities Fast Tuning System Based on Piezoelectric Actuators

Degradable elastomer composites containing layered silicate

Application of zinc and magnesium oxides nanoparticles in crosslinking of carboxylated butadiene-acrylonitrile rubber