Lodz University of Technology – TechConnect Briefs

Positioning of Thermal Via Regions for Reducing Hotspot Temperature in 3D ICs

Maj C., Galicia M., Zajac P., Napieralski A., Lodz University of Technology, PL

The increase of the processor performance is the most desired result of technology evolution. As today’s technology reaches its limits, some other methods has to be developed to uphold performance increase. One of the promising [...]

Application of ant colony optimization algorithm to the thermal parameter estimation of modern electronic structures

Raszkowski T., Samson A., Zubert M., Janicki M., Napieralski A., Lodz University of Technology, PL

Modelling of the heat transfer parameters is a very important issue and crucial aspect of the proper operating of every modern electronic structure and device. Therefore, the accurate estimation of all thermal parameters may contribute [...]

3-D Thermal Simulator Dedicated for Modern Silicon Structures

Zubert M., Raszkowski T., Janicki M., Samson A., Jankowski M., Napieralski A., Lodz University of Technology, PL

The accurate thermal modelling of nanoscale chips is of vital importance, as heat dissipation is arguably one of the most important problems in modern integrated circuits. As the technology node is expected to continue to [...]

Time-Domain Monte-Carlo and Noise Analysis of MAPS Sensors

Jankowski M., Napieralski A., Lodz University of Technology, PL

A non-typical approach to extended simulational analysis for monolithic active pixel (MAPS) based binary pixel readout circuits is presented. Circuit solutions and simulation results are presented and discussed. Applications of particle detection/tracking are quite wide, [...]

High-voltage Edge-rounded Adjustable Trapezoidal Waveform Generators

Jankowski M., Napieralski A., Lodz University of Technology, PL

An approach to design low-voltage and high-voltage trapezoidal waveform generators with edge-rounding ability is described. The paper presents circuits able to produce edge-rounded trapezoidal waveforms, endowed with several means of waveform parameter adjustments. Signal paths [...]

The Heat transfer in Fin-FET transistor

Zubert M., Janicki M., Raszkowski T., Samson A., Napieralski A., Lodz University of Technology, PL

The electro-thermal analysis is one of the most important development steps in the professional design of analogue submicron electric ICs, power modules design process as well as modern nanostructures. This analysis is useful to power [...]

Application of Dual-Phase-Lag Model for Thermal Analyses of Electronic Nanostructures

Janicki M., Zubert M., Samson A., Napieralski A., Lodz University of Technology, PL

This paper presents the Dual-Phase-Lag (DPL) equation as a possible candidate to model heat transfer processes in electronic nanostructures. The analyses presented in this paper are carried out for a thin one-dimensional slab heated on [...]

Modeling of Electromagnetic Phenomena Inside Modern Integrated Semiconductor Structures

Zubert M., Jankowski M., S. Nowak P., Raszkowski T., Samson A., Napieralski A., Lodz University of Technology, PL

The modeling and simulation of electromagnetic phenomena can be useful in modern ICs. This is an important issue, because of the direction of development of new semiconductor technologies. The distance between devices constantly decreases, while [...]

Degradability of polymeric composites (ENR/PLA) from renewable resources

Masek A., Zaborski M., Lodz University of Technology, PL

In our research, we reported on biodegradable composites exhibiting specificity properties by melt blending of polylactide (PLA), one of the commercially available biodegradable material, and epoxidized natural rubber (ENR). Blending of ENR with different types [...]

Natural polyphenols as pro-ecological antioxidants and pigments for polymer composites

Masek A., Zaborski M., Lodz University of Technology, PL

In our studies, we propose the use of natural, pro-ecological substances such as polyphenols to protect elastomers against ageing. This natural compounds were incorporated into ethylene-norbornene (COC-material is commercially available under the name of TOPAS); [...]