Raszkowski T., Samson A., Zubert M., Janicki M., Napieralski A.
Lodz University of Technology, PL
Keywords: ant colony algorithm, electronic structures, heat equation, heat transfer coefficient, thermal model
Modelling of the heat transfer parameters is a very important issue and crucial aspect of the proper operating of every modern electronic structure and device. Therefore, the accurate estimation of all thermal parameters may contribute to further optimization of such structures and significant improvement on their reliability. One of that kind of thermal parameters which is needed to be estimated is the heat transfer coefficient [3,4]. Estimation of this kind of parameters is extremely difficult to be prepared due to the fact that the analyzed heat transfer coefficient strongly depends on the dimensions and shape of investigated structure and the temperature of its surface, as-well-as external environment [1,2]. Due to this fact, the extraordinarily important issue is the choice of possibly the best method which helps in obtaining the satisfying results. This paper demonstrates the description of the ant colony optimization algorithm employed to the estimation of the thermal parameters, especially to the prediction of the value of heat transfer coefficient including real radiator and real heat-sink. The simulation results are also presented and carefully discussed. References [1] C. Koerner, H.W. Bergmann, ‘The physical defects of the hyperbolic heat conduction equation’, Applied Physics A: Materials Science & Processing, vol. 67, pp. 397-401, 1998. [2] D.W. Tang, N. Araki, ‘Analytical solution of non-fourier temperature response in a finite medium under laser-pulse heating’, Heat and Mass Transfer, vol. 31, pp. 359-363, 1996. [3] M. Zubert, G. J. Anders, A. Napieralski, A. Skorek: Rating of Pipe-Type Cables with Slow Circulation of Dielectric Fluid. IEEE Transactions on Industry Applications, 43(5):1164–1171, 2007. [4] M. Janicki, A. Samson, T. Raszkowski, M. Zubert, A. Napieralski, Comparison of Green’s function solutions for different heat conduction models in electronic nanostructures, Microelectronics Journal (2015), http:// dx.doi.org/10.1016/j.mejo.2015.07.008, pp. 1-5, ISSN: 0026-2692
Journal: TechConnect Briefs
Volume: 4, Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2016
Published: May 22, 2016
Pages: 191 - 195
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Nanoelectronics
ISBN: 978-0-9975-1173-4