US – Page 480 – TechConnect Briefs

Modeling Image Formation in Layered Structures: Application to X-ray Lithography

Bollepalli S.B., Khan M., Cerrina F., UW-Madison, US

In the fabrication of semiconductor devices using lithography, the modeling of the exposure process is very often needed. The elements of a typical exposure system from a modeling perspective comprise of a radiation source, a [...]

A Method of MOSFET Dopant Profile Prediction and its Use in Transistor Design

Kulkarni M., Vasanath K., Davis J., Saxena S., Pollack G., Texas Instruments, Inc., US

As MOS transistor size shrinks to sub-quartermicron dimensions, accurate knowledge of the dopant concentration in various regions of the transistor is becoming more and more important for device simulations. We have developed a methodology to [...]

A Semi-Empirical Resist Dissolution Model for Sub-micron Lithographies

Khan M., Bollepalli S.B., Cerrina F., UW-Madison, US

In this paper, we present a new resist dissolution model suitable for large range of application domains - from memory devices employing < 130nm design rules to MEMS devices with design rules exceeding 10s of [...]

Computer Aided Mask-Layout for Bulk Etch Fabrication

Long M.K, Burdick J.W., Antonsson E.K., California Institute of Technology, US

This paper presents a method to synthesize the mask layout geometry for a MEMS wet etching process. Given a desired part geometry, the method determines a candidate mask geometry that will etch to the final [...]

Molecular Dynamics (MD) Simulations of Reactive Ion Etching (RIE) of Silicon by Cl, Cl2, Br and Br2 Cations

Valone S.M., Hanson D.E., Kress J.D., Los Alamos National Laboratory, US

Simulations of Cl plasma etch of Si surfaces with MD techniques agree reasonably well with the available experimental information on yields and surface morphologies. This information has been supplied to a Monte Carlo etch profile [...]

Simulation and Modeling of Optoelectronic Devices, Circuits and Systems

Morikuni J.J., Mena P.V., Harton A.V., Wyatt K.W., Motorola, US

Holographic optical elements fabricated from DuPont's OMNIDEXô photopolymer have been demonstrated in a variety of product prototypes in which optical interconnect and semiconductor optoelectronic devices are integrated. With the emergence of Fibre Channel, Gigabit Ethernet, [...]

Challenges in Process Modeling for MEMS

Dutton R.W., Chan E.K., Wilson N.W., Hsiau Z-K, Shen S., Stanford University, US

The potency of the silicon IC technology base, its use of CAD for design targeted for manufacturing and the related challenges faced in deployment of MEMS are discussed. The rapidly growing field of MEMS has [...]