Challenges in Process Modeling for MEMS

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The potency of the silicon IC technology base, its use of CAD for design targeted for manufacturing and the related challenges faced in deployment of MEMS are discussed. The rapidly growing field of MEMS has created opportunities to merge new functional capabilities with integrated circuit (IC) electronics. MEMS fabrication uniquely requires accurate prediction of both geometry and materials dependencies that affect electrical, mechanical and other structurally constrained behavior.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 1 - 4
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-96661-35-0-3