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Rapid Reliability Assessment Using CADMP-II

McCluskey F.P., Pecht M., University of Maryland, US

One of the most time consuming activities in new product development is associated with reliability assessment and qualification. This is defined as a process to verify whether the anticipated reliability is indeed achieved under actual [...]

Numerical Fracture Analysis of MEMS Devices

Tayebi A.K., Tayebi N., Tayebi A.K., Tayebi N., Case Western Reserve University, US

Non-conventional finite element analysis (FEA) based on linear elastic fracture mechanics (LEFM) is applied to fractured MEMS specimens with notches. The objective of this paper is to test the applicability of LEFM at mesoscale and [...]

Strength Prediction for MEMS Components Transferring Large Loads

Chu L-H., Chen Q., Carman G.P., University of California, Los Angeles, US

In this paper the authors present a new strength criteria combined with a finite element analysis to predict the strength of MEMS fabricated microridges. The single crystal silicon microridges can be manufactured by various processes [...]

Modeling Nucleation and Growth of Voids During Electromigration

Richards D., Adams J.B., Borucki L.J., Arizona State University, US

We calculate the formation energy of small voids in Al and Cu, both at the bulk and at grain boundaries, using the Embedded Atom Method. Then, we use those results as input to a Kinetic [...]

Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films

Dalla Torre J., Gilmer G.H., Windt D.L., Baumann F.H., Huang H., Díaz de la Rubia T., Djafari-Rouhani M., Bell Labs, Lucent Technologies, US

We present Monte Carlo simulations of metallic thin films grown by sputter deposition from an infinite target. The Monte Carlo model includes ballistic deposition from the target, surface diffusion, and polycrystalline film growth. We study [...]

3D Modeling of Metallic Grain Growth

George D., Carlson N., Gammel J.T., Kuprat A., Los Alamos National Laboratory, US

This paper will describe simulating metallic grain growth using our Gradient Weighted Moving Finite Elements code, GRAIN3D. We also describe the set of mesh topology change operations developed to respond to changes in the physical [...]

Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids

Bassman L., Garikipati K., Deal M., Stanford University, US

A new formulation and computational framework is presented for modeling coupled self-diffusion and mechanics in polycrystalline materials. The continuum formulation includes constitutive models derived from lattice-level thermodynamic and mechanical considerations. From a complete statement of [...]

Modeling Facet Growth of Cu Thin Films

Wang Z., Li Y., Adams J.B., Arizona State University, US

We present a Kinetic Lattice Monte Carlo (KLMC) model, which describes deposition, surface self-diffusion, nucleation, and film growth on fcc metal substrates. The activation energies for diffusion are calculated using embedded-atom method (EAM). Using this [...]

TopoSim3D/Grain3D: Modeling Surface Deposition and Growth

Gammel J.T., Walker R., Los Alamos National Laboratory, US

We discuss the coupling we are develping between TopoSim3D and Grain3D - two tols making use of the Los Alamos LaGriT adaptive grid toolset. TopoSim3D is a three-dimensional profile simulation tool being developed at Los [...]

Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique

O'Sullivan P.L., Baumann F.H., Gilmer G.H., Bell Laboratories, Lucent Technologies, US

We have performed 2D and quasi-3D numerical simulations of physical vapor deposition (PVD) into high aspect ratio trenches used for modern VLSI interconnects. The topographic evolution is modeled using (continuum) level set methods. The level [...]