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Diffusion Induced Stresses in Microstructures of MEMS

Yang F., University of Rochester, US

The diffusion-induced stresses in silicon wafers were studied. The effect of local electric field on dopant diffusion was considered in the diffusion equation. Only one-dimension problem with a constant surface dopant concentration was investigated. The [...]

Layout Verification and Correction of CMOS-MEMS Layouts

Baidya B., He K., Mukherjee T., Carnegie Mellon, US

The advent of CMOS micromachining has introduced new design rules for fabrication of integrated CMOS-MEMS devices. This paper presents a context dependent DRC algorithm to handle the issues related to pre-fabrication verification of such layouts. [...]

Physical Modeling of MEMS Cantilever Beams and the Measurement of Stiction Force

Lam T., Darling R.B., University of Washington, US

A finite element model is combined with experimental data to extract the stiction force in MEMS cantilever beams. The model predicts cantilever behaviors both before and after snap-down has occurred. Experimental measurements of cantilevers have [...]

Direct Write Technology as a Tool to Rapidly Prototype Patterns of Biological and Electronic Systems

Ringeisen B.R., Chrisey D.B., Piqué A., Krizman D., Brooks M., Spargo B., Naval Research Laboratory, US

The full potential of modeling and simulations is only realized when it is based on experimental results under varied conditions and systems. A single tool to rapidly prototype electronic and biological circuits would enhance the [...]

Mechanical Property Measurement of Thin-film Gold Using Thermally Actuated Bimetallic Cantilever Beams

Pamula V.K., Jog A., Fair R.B., Duke University, US

We describe a method for estimating the Young's modulus of thin-film gold deposited on the poly2 layer in the MUMPS process is described. An optical detection system employing position sensitive detectors (PSD) is built to [...]

3-D Computational Modeling of RF MEMS Switches

Espinosa H.D., Fischer M., Zhu Y., Lee S., Northwestern University, US

Young's modulus and residual stress state of freestanding thin membranes are characterized in this work by means of wafer level experimental techniques. RF MEMS Switches manufactured by Raytheon Systems Co. are investigated using a new [...]

Stress Measurement in MEMS Devices

Starman Jr. L., Busbee J., Reber J., Lott J., Cowan W., Vandelli N., Wright-Patterson AFB, US

Due to the unique structure and small scale of Micro-Electro-Mechanical Systems (MEMS), residual stresses during the deposition processes can have a profound affect on the functionality of the MEMS structures. Typically, material properties of thin [...]

Finite Element Analysis in the Development of MEMS-based Compound Grating (MCG)

Yao Y., Castracane J., Xu B., Olson S., Eisden J.V., University at Albany-SUNY, US

This paper presents the development of the 1 mm ruled MEMS-based Compound Grating (MCG) in which the structural material of the rulings is SiO2 coated with Cr/Au as the top electrode. The MEMS simulation package [...]

Modeling and Simulation on Two Passive Feedback Methods to Obtain Large Travel Range of Electrostatic Micro Mirrors

Wu X.T., Xiao Z.X., Zhe J., Farmer K.R., New Jersey Institute of Technology, US

This paper demonstrates two passive feedback methods to obtain increased travel range in electrostatic micro actuators directly in the electrostatic domain. The first method is modeled as a series capacitor loop in which an integrated [...]

Modeling the Effects of Joint Clearances in Planar Micromechanisms

Wittwer J.W., Howell L.L., Chase K.W., Brigham Young University, US

Surface micromachining of micro-electro-mechanical systems (MEMS) has inherent limitations that can lead to mechanisms having an undesirable amount of clearance in revolute and prismatic joints. In micro devices, where actua-tion of the mechanisms is often [...]