TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeCountriesDE

Country: DE

Germany

FE-Simulations as a Part of a Tolerance Management System

Straube D., Germer C., Franke H-J, Triltsch U., Büttgenbach S., Technical University Braunschweig, DE
This paper reports on a software tool, which enabled tolerance management based on FE-Simulations and want to deliver impressions of the benefits of this coupling. The term tolerance management unites analysis, i.e. investigation of effects [...]

Modeling of the Cosmic Radiation-Induced Failure Mechanism in High Power Devices

Kaindl W., Soelkner G., Schulze H.-J., Wachutka G., Institute for Physics of Electrotechnology, DE
In order to achieve a more robust design of semiconductor power devices with enhanced hardness against cosmic radiation we have been working on a physical model which is able to explain and to visualize the [...]

Combination of Analytical Models and Order Reduction Methods for System Level Modeling of Gyroscopes

Schneider P., Reitz S., Bastian J., Schwarz P., Döring C., Maute M., Neul R., Fraunhofer Institute for Integrated Circuits, DE
Within complex sensor systems different physical effects and electronics for signal processing have to be considered in the design process. In this paper we describe an approach for system level simulation of sensor systems and [...]

Stress Optimization of a Micromechanical Torsional Spring

Klose T., Kunze D., Sandner T., Schenk H., Lakner H., Schneider A., Schneider P., Schneider A., Schneider P., Fraunhofer IPMS, DE
In this paper we present a method for the design of a stress-optimized, micromechanical torsional spring, used in MEMS. Our optimization approach is based on a software tool for simulator-based optimization MOSCITO, cooperating with the [...]

T-CAD Environment for Multi-Material-MEMS Design

Triltsch U., Büttgenbach S., Straube D., Franke H-J, Technical University of Braunschweig, DE
The presented approach delivers a design tool for multi-material MEMS and can act as a system level tool with interfaces for component level analysis tools. The platform provides interfaces to different knowledge bases which either [...]

Computer-Based Process Design Support for MEMS

Wagener A., Popp J., Schmidt T., Hahn K., University of Siegen, DE
A process management and development system for MEMS design is introduced. It allows the specification of processes for specific applications and the tracking of the development procedures. Unlike in microelectronics the process configuration for MEMS [...]

Modeling of a New Acceleration Sensor as part of a 2D Sensor Array in VHDL-AMS

Markert E., Schlegel M., Dienel M., Herrmann G., Müller D., Chemnitz University of Technology, DE
In this paper we present an approach for modeling and simulation of a new acceleration sensor using VHDL-AMS. The sensor consists of four capacitive segments and one mass segment, aligned in a semicircle. Each capacitive [...]

Modeling of Size Quantization in Strained Si-nMOSFETs with the Improved Modified Local Density Approximation

Nguyen C.D., Jungemann C., Meinerzhagen B., Technical University Braunschweig, DE
An Improved Modified Local Density Approximation (IMLDA) model for the electron inversion layer in strained Si-nMOSFETs is presented which correctly describes the impact of size quantization on the threshold voltage and capacitance without increasing the [...]

Failure of Macroscopic Transport Models in Nanoscale Devices near Equilibrium

Jungemann C., Grasser T., Meinerzhagen B., Technische Universität Braunschweig, DE
The shrinking of the device dimensions below 100nm is pushing the classical TCAD tools like the drift-diffusion (DD) or hydrodynamic (HD) models to their limits. While the impact of the shrinking on the accuracy of [...]

New Product Development for Nanomaterials Systems and Solutions

Varga G., Kroell M., Degussa AG, DE
In the past several years there has been a tremendous increase in activities in the field of Nanomaterials Technology. This recent increase in activity is a result of improved analytical methods which allow scientists and [...]

Posts pagination

« 1 … 25 26 27 … 40 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.