Yield and Reliability – TechConnect Briefs

Papers:

A Simple VLSI Spherical Particle-Induced Yield Predictor

Nakamae K., Ohmori H., Fujioka H., Osaka University, JP

A simple VLSI particle-induced yield predictor has been developed that allows us to predict the entire yield of VLSI and also to analyze the bottleneck processing steps and faults. Particles with spherical shape are generated [...]

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

Ramminger S., Mitic G., Türkes P., Wachutka G., Siemens AG, DE

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of [...]

Strength Prediction for MEMS Components Transferring Large Loads

Chu L-H., Chen Q., Carman G.P., University of California, Los Angeles, US

In this paper the authors present a new strength criteria combined with a finite element analysis to predict the strength of MEMS fabricated microridges. The single crystal silicon microridges can be manufactured by various processes [...]

Numerical Fracture Analysis of MEMS Devices

Tayebi A.K., Tayebi N., Tayebi A.K., Tayebi N., Case Western Reserve University, US

Non-conventional finite element analysis (FEA) based on linear elastic fracture mechanics (LEFM) is applied to fractured MEMS specimens with notches. The objective of this paper is to test the applicability of LEFM at mesoscale and [...]

Rapid Reliability Assessment Using CADMP-II

McCluskey F.P., Pecht M., University of Maryland, US

One of the most time consuming activities in new product development is associated with reliability assessment and qualification. This is defined as a process to verify whether the anticipated reliability is indeed achieved under actual [...]

Inductive Fault Analysis of a Microresonator

Jiang T., Kellon C., Blanton R.D., Carnegie Mellon University, US

We study the failure mechanisms of a microresonator. A MEMs process simulation tool is used to discover the full spectrum of defective structures caused by particulate contaminations introduced during manufacturing. Based on process simulation results, [...]

Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6