Papers:
Inductance Calculation in Interconnect Structures
We present a package based fnite elements for two and three-dimensional analyses of interconnect structures. Two preprocessors allow a layer-based input of the simulation geometry and the specification of the boundary conditions. Additionally, a third [...]
Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells
A fundamental proble of all FEM capacitance computations in MEMS and ULSI is to determine proper mesh size for the elements representing the considered model. In particular, opticaml mesh size selection is crucial for large [...]
Hybrid P-Element and Trefftz Method for Capacitance Computation
The paper discusses efficient electrostatic field solutions techniques to simulate micro electro mechanical systems (MEMS): adaptive p-elements to remove the burden of manual mesh refinement; hybrid finite elements - Trefftz formulation to treat open boundary [...]
Wavelet Based Matrix Compression in Numerical Micromagnetics
Magnetic sensors and magneto-mechanic devices consist of spatially distinct ferromagnetic parts. Modeling their functional behavior requires to take into account the magnetostatic interactions between the magnetic elements. A hybrid finite element / boundary element method [...]
Transient Simulation of Ferroelectric Hysteresis
We present amodel that allows the analysis of the behavior of ferroelectric materials in a wide range of frequencies. A common approach to the transient properties of dielectrics based on differential equations was extended by [...]
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-7-0