Harlander C., Sabelka R., Selberherr S.
Technical University of Vienna, AT
Keywords: finite element method, inductance calculation, multiple integrals
We present a package based fnite elements for two and three-dimensional analyses of interconnect structures. Two preprocessors allow a layer-based input of the simulation geometry and the specification of the boundary conditions. Additionally, a third preprocessor provide a fully unstructered three-dimensional grid generation. The tetrahedralization engine uses a modified advancing fron Delaunay algorithm. The main module calculates beside the resistances, capacitances and inductances of interconnect structures, the distribution of the electric potential, the temperature and the current density. It can be applied for optimization of interconnect structures as well as for studies to verify the reliability of interconnects, as a transient0electric simulation mode [1] is also available to calculate the capacitive crosstalk and delay times. As application example a spiral inductor is analyzed.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Pages: 416 - 419
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-7-0