Papers – Page 12 – TechConnect Briefs

Ultra High performance In-line Contact MEMS RF Switch

Hong Y-T, Kim C-H, Lee S-H., Kwon S-W, Song I-S, Samsung Advanced Institute of Technology, KR

An in-line direct RF MEMS Switch was presented in this paper. This switch having single contact point was fabricated, and characterized. The switch is a series type and is actuated by a supportive membrane. A [...]

Sensitivity to Shape and Membrane Thickness Variations in Capacitive Pressure Sensors

Sabet A., Avula X.J., Washington University in St. Louis, US

capacitive pressure sensor, membrane thickness, membrane shape, sensitivity

A Capillary Electrophoresis Chip for Rhodamine B and Inorganic Ion detection Utilizing Contactless Capacitance Detection

Liu W.L., Chen W.J., Hsieh S.H., Tsai T.K., National Pingtung University of Science and Technology, TW

A microfluidic channel and a contactless capacitance detector wereintegrated on a glass chip by a semiconductor manufacturing process forseparating and analyzing Rhodamine B and inorganic ion. The electrodes of thecapacitance detector were formed successively by [...]

Dielectrophoretic ratchets for linear and rotary nanomotors

Hughes M.P., Astumian R.D., University of Surrey, UK

Dielectrophoresis (DEP) is a phemomenon of induced particle motion in non-uniform electric fields. In this paper, we will describe how the phenomenon can be used to design electrokinetic ratchet devices to provide both linear and [...]

Investigating the Benefit-Cost of MEMS Application for Structural Health Monitoring of Transportation Infrastructure

Jha M.K., Davy A.B., Morgan State University, US

This paper develops a fuzzy-logic based procedure for quantitative cost and benefit calculation of MEMS application for structural health monitoring of transportation infrastructure. This will be a major step forward for widespread MEMS application in [...]

Frequency Tuning of Micro-beams using Electrostatic Pull-in

Burdess J.S., Harris A.J., Kafumbe S., University of Newcastle, UK

The work reported shows how the frequency of vibration of simple beam structures can be changed significantly through the action of electrostatic pull-in. The application of a voltage between the beam and a supporting, but [...]

Three-dimensional Simulation method of Anisotropic Wet Chemical Etching Process

Lee J-G, Won T., Inha University, KR

Anisotropic wet chemical etching is still one of the fundamental techniques employed in silicon bulk micromaching. However, there are still unsolved problems with the simulation of the process. And most of the available simulation software [...]

MEMS Reliability Assessment Program – Progress to Date

Zunino III J.L., Skelton D.R., U.S. Army ARDEC, US

As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the [...]

Biocompatible Hybrid System Integration of Silicon Based Neural Interface Device

Tathireddy P., Chakravarthy S., Hsu J., Klein M., Oppermann H., Rieth L., Harrison R., Normann R.A., Solzbacher F., University of Utah and Fraunhofer Institute, Germany, US

Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for [...]

The Bonding Technology for Microchannels with Electrode Patterns on the Glass Substrates

Parng S.H., Yang H.J., Shia T.K., Microsystem Technology Common Laboratory, TW

Objectives: Bonding surface preparation, process conditions, and integrated on-chip metal sheet resistance variation during bonding process were investigated in this work. Methods: We flatten the surface of the etched micro-channels with a fresh solution of [...]