Biocompatible Hybrid System Integration of Silicon Based Neural Interface Device

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Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for a stacked hybrid assembly of silicon, polyimide, ceramics and SMD components for the next generation wireless neural interface. The device consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils, SMD components and a Utah Electrode Array (UEA) with metallization on the backside. The coils can be operated as single or switched in parallel or series coils to modify frequency range and voltage gain.

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Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 7, 2006
Pages: 357 - 360
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9767985-8-1