Papers – Page 10 – TechConnect Briefs

Modeling of Stress Induced Hysteresis in Piezo-Resistive Analysis

The impact of mechanical stress on electrical characterizations of microelectronic circuitry is a major design issue in development of sensors and integrated micro-electro-mechanical systems. Because the electrical properties of semiconductors are in uenced by external [...]

Optimal Time Stepping in the Thermo-mechanical Finite Element Simulation of IGBTs Modules

Tronel Y., Fichtner W., ETH Zürich, CH

In the analysis of the thermo-mechanical response of the wire bond connection found e.g in IGBTs modules, it has been found that the level of stresses are within the plastic range [1]. Therefore an incremental [...]

Analysis of Unstable Behavior Occurring in Electro-Mechanical Microdevices

König E-R, Wachutka G., Münich University of Technology, DE

We analyze the instability which is inherent to electrostatically driven microdevices. Further, we propose a homotopy method to overcome this difficulty during simulation of these devices. Starting from a simplified model, the governing differential equations [...]

Optimum Algorithm for Electronic System Design

Zemliak A., Puebla Autonomous University, MX

The evaluation of operations number for the system design has been done for general design strategy. More general methodology for the system and circuit design was elaborated by means of optimum control theory formulation. This [...]

Parallel Domain Decomposition Applied to 3D Poisson Equation for Gradual HBT

García-Loureiro A.J., Pena T.F., López-González J.M, Prat Viñas Ll., Univ. Santiago de Compostela, ES

This paper presents the implementation of a parallel solver for the 3D Poisson equation applied to gradual HBT simulation in a memory distributed multiprocessor. The Poisson equation was discretized using a finite element method (FEM) [...]

Analytic 3D Greens Function Approach to Scattering and Diffraction from Patterned and/or Imperfect Multilayers

Gallatin G.M., Bell Labs, Lucent Technologies, US

The 3D electromagnetic Greens function Gij(x,x) for planar multilayers is constructed from the eigenmodes of Maxwellís equations in the multilayer structure. Other approaches hav been used to derive the Greens function and the derivation here [...]

A Design Tool for Inductive Position and Speed Sensors via a Fast Integral Equation Based Method

Kamon M., Nguyen A-M., Gilbert J.R., Microcosm Technologies, Inc., US

This paper describes using 3D integral equation based simulation in combination with simulation managment to provide a design tool for an eddy-current inductive position and speed sensor under development at CSEM Microsystems. Both the frequency [...]

Numeric Aspects of the Simulation of Two-Dimensional Ferroelectric Hysteresis

Dragosits K., Selberherr S., TU Vienna, AT

Simulation of ferroelectric hysteresis allows the analysis of nonvolatile memory cells which are based on ferroelectric materials. We give an overview of our algorithm for the calculation of effects caused by field rotation. Implementation of [...]

Investigation of Tetrhedral Automatic Mesh Generation for Finite-Element Simulation of Micro-Electro-Mechanical Switches

Wilson N.M., Pinsky P.M., Dutton R.W., Stanford University, US

Simulation of micro-electro-mechanical systems (MEMS) typically involves the requirement to mesh complex 3-D representations of the geometry. Since proper manual or semi-automated mesh generation requires significant user time and knowledge, there is great interest in [...]

Transient Electromagnetic Behaviour of Multiply Contacted Interconnects

Böhm P., Wachutka G., Münich University of Technology, DE

This paper presents a methodology for the analysis of the transient electromagnetic behavior of multiply contacted interconnects. It is shown that for applications with high switching frequencies and high pulse repetition rates with subsequent steep [...]