In the analysis of the thermo-mechanical response of the wire bond connection found e.g in IGBTs modules, it has been found that the level of stresses are within the plastic range . Therefore an incremental (or/and) transient analysis is necessary to obtain reliable data for a further fatigue analysis for example. The subsequent increase of computational time when compared to the thermo-elastic case is so important that the reduction of computational time must be searched in every possible direction. This paper focuses on the time stepping optimization. The time integration features are first recalled. In a second section, the time stepping optimization itself is described with its various possible variants. Finally, numerical examples are discussed.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Pages: 334 - 337
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems