MEMS & NEMS Devices, Modeling & Applications – Page 74

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations

Marco S., Carmona M., Samitier J., Universitat de Barcelona, ES

While analyzing the behaviour of complex systems it is not practical to carry out the simulation of the complete model a the physical level In order to move from simulations at tne physical level towards [...]

A Least Squares Algorithm for Optimal Heater Placement in Microsensors

Liu C.C., Man P.F., Mastrangelo C.H., University of Michigan, US

In this paper we present an algorithm that yields the optimal placement of a finite number of constant power density heaters for an arbitrary desired temperature profile. Using this algorithm, the volume efficiency (the percentage [...]

Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity

Mladenovic D., Hutchins J., Tran E., Lu S., Motorola, US

This article reviews elements needed to be considered in order to improve accuracy of the temperature coefficient and sensitivity (span) simulation for diffused piezoresistors. Modeling is done through an algorithm developed in 'Mathematica'. Input parameters [...]

Reduced Electro-Thermal Models for Integrated Circuits

Furmanczyk M., Napieralski A., Szaniawski K., Tylman W., Lara A., Technical University of Lodz, PL

Power dissipation density in today's integrated circuits makes thermal problems very important. Unfortunately, the electro-thennal co-simulations, which are often indispensable in solving thennal issues, are constrained by the lack of the IC's electro-thermal models. This [...]

Topic: MEMS & NEMS Devices, Modeling & Applications

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations

A Least Squares Algorithm for Optimal Heater Placement in Microsensors

Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity

Reduced Electro-Thermal Models for Integrated Circuits

Thermo-Mechanical Modeling