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HomeTopicsMaterials Characterization & Imaging

Topic: Materials Characterization & Imaging

A New High Precision Procedure for AFM Probe Spring Constant Measurement using a Microfabricated Calibrated Reference Cantilever Array (CRCA)

Reitsma M.G., Gates R.S., National Institute of Standards and Technology, US
A new technique for calibrating Atomic Force Microscope (AFM) cantilevers is demonstrated using a unique array of microfabricated reference cantilevers. The array, consisting of seven uniform rectangular cantilevers of different length (and thus stiffness), was [...]

Mechanical Properties Measurement of Nanowires Anisotropic Conductive Film by Nanoindentation Technique

Hsu Y-Y, Lin R.J., Kuo T-Y, Su Y-Y, Uang R-H, Cheng H-C, Industrial Technology Research Institute, TW
In this investigation, a new type of anisotropic conductive film composed by nanowires and polymer was developed. Anodic aluminum oxide (AAO) film was uses as a template to obtain cobalt nanowires by electro-deposition. Low viscous [...]

Size-Dependent Elastic Moduli of Nanofilms

Chang I-L, Huang J-C, National Chung Cheng University, TW
A semi-continuum model is constructed for the analysis of face-cubic-center crystal structure nanofilms to study the size dependence of the elastic properties. Unlike the classical continuum theory, the current model directly takes the discrete nature [...]

Comparison between Nanoindentation and Scratch Test Hardness (Scratch Hardness) Values of Copper Thin Films on Oxidised Silicon Substrates

Chowdhury S., Beegan D., Laugier M.T., University of Alabama at Birmingham, US
We have measured hardness i.e. scratch hardness from the scratch tester usually used for investigating adhesion in thin films and compare this with hardness measured by the nanoindentation technique on copper thin films. We defined [...]

Abrasive Wear Studies on Cobalt Electrodeposited Surfaces with Tio2 Dispersions

Kalyanaraman D., SUDHARSAN ENGINEERING COLLEGE, SATHIAMANGALAM - 622501, PUDUKOTTAI DISTRICT, TAMINNADU, INDIA, IN
Cobalt depositions are generally preferred for high temperature applications. When a second phase of fine tough particles are incorporated in the coating matrix, Tribological properties are found to have improved much. The performance of such [...]

The Relationship Between Nanoscale AFM Adhesive Force Measurements using Calcite Crystals with Macroscale contact angle and Scaling Characteristics

Boyd R.D., Bargir S., Dunn S., Jefferson B., Cranfield University, UK
The growth of scale, which primarily consists of calcite crystals, is a major problem in water systems. AFM probes have been modified with calcite crystal in order to measure the strength of adhesion between the [...]

New reference standards and artifacts for nanoscale property characterization

Pratt J.R., Kramar J.A., Shaw G., Gates R., Rice P., Moreland J., National Institute of Standards and Technology, US
This paper provides an overview of calibration artifacts being developed at NIST that will greatly aid the accurate determination of nanoscale physical properties across a broad range of applications. We focus on three proposed reference [...]

Investigation of the Deformation Mechanics in Nanoindenter Deflected Freestanding Submicron Gold Thin Films

Wang L., Prorok B.C., Auburn University, US
The Membrane Deflection Experiment (MDE) was employed to perform the microscale tensile testing on freestanding thin films of various FCC metals. Process parameter adjustments and annealing were performed to modulate the film microstructure. High-resolution SEM, [...]

Microfabrication and Mechanical Characterization of Suspended Carbon Microstructures

Malladi K., Wang C., Madou M.J., Xue W., Cui T., University of California Irvine, US
The idea of suspended carbon micro/nanostructures has been researched by a few research groups ], however, controlled fabrication of suspended carbon micro/nano structures in desired positions and with the desired shape and dimension is still [...]

A Novel Approach of Sample Preparation for SCM Inspection in the DRAM Device Structures

Lue J.L., Liu H.W, Wu E., Pai B., Fan S., Wang T., ProMOS Technologies Inc, TW
This paper discusses the removal of the doped-polysilicon of a gate transistor by wet chemical etching containing the spacer oxide and nitride that remain. This technique significantly improves the image quality of 2-D doping profile [...]

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