TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeTopicsInformatics, Modeling & Simulation

Topic: Informatics, Modeling & Simulation

Application of Machine Learning and Swarm Intelligence to Wastewater Treatment

, Cascade Clean Energy, Inc., US
Swarm intelligence (SI) is a branch of artificial intelligence, which has been existing in nature among grouping and activities of animals, birds, ants, fish or even microbes. Swarm Intelligence is the collective behavior of decentralized, [...]

Two Examples of Nonclassical Fullerenes with Dodecahedral Structure

Sanchez Bernabe F., Universidad Autónoma Metropolitana, MX
Two nonclassical fullerene are presented. The first one contains heptagonal faces, besides pentagons, and hexagons.This example contains 420 carbons. There are 60 heptagons. The number of hexagons is 80, and finally, we have 72 pentagons. [...]

Molecular Modeling of Silicon-Based Anode Material for High-Performance Lithium-Ion Batteries

Schweizer S., Low J.J., Subramanian L., Scienomics, US
Lithium(Li)-ion batteries are widely used in portable electronic devices. Their use as energy storage system in other important industrial fields - such as electric vehicles, wind turbines, or photo voltaic plants - is limited by [...]

Recent Advances in Industrial Coarse-Grained Method Development & Modeling

Handgraaf J.-W., Fraaije J.G.E.M., Culgi, NL
In present day the crux of performing coarse-grained simulations is the actual parameterization of the (molecular) interactions and the validation of the outcome of a simulation. In a recent effort we have work on the [...]

Materials data management in research & development: improving innovation and product liability

Ehrig T., Klepsch L., IMA Materialforschung und Anwendungstechnik GmbH, DE
Challenge Companies produce a huge amount of notes and tables, especially for their research and development processes. A lot of different tools are used to store such information:  Note-taking apps, like Mind-Mappers, One-Note, ... [...]

Informatics, Modeling & Simulation

Simulation of Breakdown Voltage Enhancement in AlGaN/GaN HEMTs with Double Passivation Layers

Horio K., Hanawa H., Shibaura Institute of Technology, JP
It is well known that the introduction of field plate increases the breakdown voltage of AlGaN/GaN HEMTs [1, 2]. However, it increases the parasitic capacitance, leading to the degradation of high-frequency performance. As another way [...]

Positioning of Thermal Via Regions for Reducing Hotspot Temperature in 3D ICs

Maj C., Galicia M., Zajac P., Napieralski A., Lodz University of Technology, PL
The increase of the processor performance is the most desired result of technology evolution. As today’s technology reaches its limits, some other methods has to be developed to uphold performance increase. One of the promising [...]

Effects of Buffer Acceptors on Breakdown Voltages of AlGaN/GaN HEMTs with a High-k Passivation Layer

Kawada Y., Hanawa H., Horio K., Shibaura Institute of Technology, JP
AlGaN/GaN HEMTs are now receiving great interest for application to high-power microwave devices and high-power switching devices. However, the breakdown voltage is known to be greatly lower than that theoretically predicted. To improve the breakdown [...]

Reduction in Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs with High Acceptor Density in a Buffer Layer

Saito Y., Tsurumaki R., Noda N., Horio K., Shibaura Institute of Technology, JP
We make a two-dimensional transient analysis of field-plate AlGaN/GaN HEMTs with a semi-insulating buffer layer, where a deep acceptor above the midgap is considered. It is studied how the deep-acceptor density and the field plate [...]

Posts pagination

« 1 … 3 4 5 … 83 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.