Advanced Manufacturing – Page 22

Towards nanofabrication with UV femtosecond fiber laser

Huang H., PolarOnyx, Inc., US

In this paper, a UV fs fiber laser was used for direct writing nanofabrication on different materials. The laser used is a commercialized mode-locked fiber laser (PolarOnyx Uranus Series), generating typically Gaussian shape pulses (750 [...]

Milling Process Control with Dimensional Feedback on a Focused Ion Beam – Scanning Electron Microscope System (FIB-SEM)

Sanabia J.E., Raith USA, Inc., US

In nanofabrication and nanoanalysis, focused ion beam – scanning electron microscope (FIB-SEM) systems are increasingly used for demanding patterning tasks which rely on precise pattern placement and/or dimension control. Easily verifying and correcting for patterning [...]

Design and Fabrication of a Large Scale Electric Field Array Device for Directed Self-Assembly of Multilayer BioDerivatized Nanoparticle Materials

Heller M.J., Song Y., University of California San Diego, US

In earlier work, an electronic microarray device was used to carry out a bottom-up approach for the directed self-assembly of higher order 3D structures from biotin/streptavidin, DNA and enzyme derivatized nanoparticles. Structures with up to [...]

NanoFab: Manufacturing & Instrumentation

Thin film transistors with printed semiconductive oxide channel and silver source-drain electrodes

Chen Z., Cui Z., Suzhou Institute of Nano-tech and Nano-bonic, Chinese Academy of Sciences, CN

In order to make all-printed thin-film transistors, the key issue such as the interfacing effect between printed electrodes and printed semiconductive channel layer has to be solved.In this study, thin film transistors were fabricated by [...]

Supramolecular Dielectric for Low Voltage Organic Electronics

Tsui H.-C.L., Steinke J., Campbell A., Imperial College London, UK

The interest in organic thin film transistor (OTFT) is rising rapidly in recent years because of its potentially low cost, flexibility, light weight and simple fabrication process. This study aims to investigate the potential of [...]

u-Helix 3D-antenna technology

Nenzi P., Sapienza - Università di Roma, IT

A new technology for the integration of 3D antenna structure in packages will be presented. The integration of antennas on top of silicon chips or, in the same package is viable for frequencies above 40GHz [...]

Compliant interconnect technology for power modules in automotive applications

Nenzi P., University of Rome “La Sapienza”, IT

This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]

Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste

Hirose A., Itou T., Ogura T., Osaka University, JP

We have proposed a new bonding process using Ag2O paste composed of Ag2O particles mixed with reduction agent of triethylene glycol (TEG). Ag nanoparticles formed at around 130℃ to 160℃ through the reduction process. Such [...]

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging

Gao F., Gu Z., Shina S., Morose G., Eliason P., Farrell R., University of Massachusetts-Lowell, US

The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]