Sensors, MEMS, Electronics – Page 410

Simple Method of Characterizing CMOS Channel Dopant Profiles Using CV Technique

Kapila D., Kulkarni M., Fernando C., Davis J., Vasanth K., Pollack G., Texas Instruments, Inc., US

In CMOS process and device simulations, characterization of complete dopant profiles in the channel region is essential for accurate simulations. We have developed a simple, fast and inexpensive methodology for characterizing CMOS channel dopant profiles [...]

Augmented Reality as an Interactive Tool for Microscopic Imaging, Measurement and Model Based Verification of Simulated Parts

Sulzmann A., Schütz C., Hügli H., Jacot J., EPFL, CH

Presently microsystems are gaining in interest. Microsystems are small, independent modules, incorporating various functions, such as electronic, micro mechanical, data processing, optical, chemical, medical and biological functions. Though improving the manufacturing technologies, the measuring of [...]

Fast Inductance Extraction of 3-D Structures with Non-Constant Permeabilities

Massoud Y., White J.K., Massachusetts Institute of Technology, US

In this paper we present a discretized integral formulation for calculating the frequency-dependent inductance and resistance for 3-D structures that contains permeable materials. The method uses a magnetic surface charge formulation, and we present analytic [...]

1/f Noise Characterization of a Surface-Micromachined Suspended Gate FET

Fu H., Kniffin M.L., Watanabe G., Masquelier M.P., Whitfield J., Motorola, Inc., US

This paper presents the first detailed characterization and modeling of 1/f noise in a depletion mode surface-micromachined suspended gate nMOSFET. The results are compared and contrasted with the 1/f noise characteristics of a standard depletion [...]

Characterization of Electrostatically-Actuated Beams Through Capacitance-Voltage Measurements and Simulations

Chan E.K., Garikipati K., Hsiau Z-K, Dutton R.W., Stanford University, US

Detailed 2D electromechanical simulations of electrostatically-actuated beams reveal phenomena not captured by 1D or quasi-2D simulations. The behavior of the beam when in contact with a dielectric layer is studied. Capacitance-voltage measurements are used to [...]

Microelectromechanical Systems (MEMS) Design and Design Automation Research Projects at Duke University

Dewey A., Fair R.B., Duke University, US

This paper presents an overview of microelectromechanical systems (MEMS) research being conducted at Duke University. The Duke University MEMS research program encompasses initiatives in both application design and design automation. These two areas serve synergistic [...]

Characterization, Parameter Extraction, Calibration

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

Sieiro J., Morrissey A., Carmona M., Marco S., Samitier J., Alderman J., Universitat de Barcelona, ES

This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with [...]

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations

Marco S., Carmona M., Samitier J., Universitat de Barcelona, ES

While analyzing the behaviour of complex systems it is not practical to carry out the simulation of the complete model a the physical level In order to move from simulations at tne physical level towards [...]