Advanced Materials & Manufacturing – Page 632

Atomic-control Placement of Individual P atoms in Si for the Fabrication of a Quantum Computer Qubit Array

Schofield S.R., Curson N.J., Simmons M.Y., Hallam T., Ruess F.J., Oberbeck L., Clark R.G., University of New South Wales, AU

The ability to control the location of individual dopant atoms within a semiconductor has enormous potential for the creation of atomic-scale electronic devices. One of the most ambitious proposals for such a device is the [...]

Zero Bias Anomalies in Electrochemically Fabricated Atomic-Scale Metal Junctions

Natelson D., Yu L.H., Rice University, US

Metallic nanojunctions (MNJ) are unique tools for examining electronic transport, correlations, quantum coherence, and disorder at the atomic scale. Extensive progress has been made in understanding clean MNJs fabricated in ultrahigh vacuum (UHV) by the [...]

Molecular Electronics

NanoMuscle at the Nano-Frontier

Nash H., MacGregor R., Von Behrens P., Szilagyi A., NanoMuscle, US

Nano scale structures: Much excitement has been generated in recent years by nano-science breakthroughs. A common characteristic of such developments has been the discovery of novel properties of materials of common composition but with characteristic [...]

Nanoscience and Nanotechnology:Two New Exciting Fields for Future Display Applications

Yaniv Z., Applied Nanotech, Inc., US

Though just two years ago nanoparticles and nanotechnology were little more than a blip on the industrial applications radar, over 1 billion in annual venture capital is expected to be invested in the field in [...]

MEMS Technologies for Communications

Nguyen C.T.-C., DARPA/MTO, US

Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]

Modelling and Simulation of Mechanical, Thermal and Electrical Behaviour of Si Cantilever with Implanted Strain Gauge

Husak M., Jakovenko J., Kulha P., Vborn Z., Czech Technical University in Prague, CZ

The paper describes methodology of design of cantilever with implanted layers in Si monocrystal. In the paper there is characterized physical model of implanted strain gauges, various girder topologies are designed and basic technological steps [...]

A Vertical MOSFET for Charge Sensing in the Convex Corner of Si Microchannels

Lim G., Park C-S, Lyu H-K, Kim D.S., Shin J-K, Choi P., Lee M., Kyungpook National University, KP

In this paper, we will present a vertical MOSFET formed in the convex corner of silicon microchannels which might be useful for detecting charged biomolecules. The cross type microchannels have four MOSFETs and four pairs [...]

Extensions of Spring Model Approach for Continuum-based Topology Optimization of Compliant Mechanisms

Sharma M., Udeshi T., Zyvex Corporation, US

This paper extends spring model approach to include multiple output formulation at arbitrary angles for a given actuation at input port. Parallel assembly for Microsystems could benefit from devices optimized with this formulation. A new [...]

Development of the Multi-pixel X-ray Microcalorimeters

Kudo H., Nakamura T., Arakawa T., Ohtsuka S., Izumi T., Shoji S., Sato H., Kobayashi H., Mori K., Morita U., Homma T., Osaka T., Mitsuda K., Yamasaki N.Y., Fujimoto R., Iyomoto N., Oshima T., Futamoto K., Takei Y., Ichitsubo T., Fujimori T., Ishisaki Y., Morita U., Ohashi T., Kuroda Y., Onishi M., Otake K., Waseda University, JP

We are developing a multi-pixel x-ray microcalorimeters in order to realize good energy resolution x-ray imaging for future Japanese X-ray astronomy missions. The energy resolutions of 10eV at 6keV and 32x32 pixels of arrayed x-ray [...]