Advanced Materials & Manufacturing – Page 276

Modularity in the Design and Volume Production of Microfluidic Devices

Podczerviensky J., Levine L., ALine, Inc., US

Robust fabrication of functional components in microfluidic devices will drive down their cost and improve their performance. We have developed a modular and readily customized approach for routine and volume production of complex microfluidic devices [...]

High-aspect-ratio deep Si etching of micro/nano scale features with SF6 /H2/ O2 plasma, in a low plasma density reactive ion etching system

Sanaee Z., Poudineh M., Mehran M., Mohajerzadeh S., University of Tehran, IR

In this paper we report a novel low plasma power reactive ion etching technique to achieve high rate, high aspect ratio features on silicon. The etching process is achieved using a sequential passivation and etching [...]

Comparaison between PDMS and PMMA for MEMS applications

Benachaiba C., Bouanini M., University of Bechar, DZ

The elastometer applications for MEMS are recent technology, in this article we modeling PDMS membrane and PMMA membrane subjected to pressure force for microvalve applications.

Fracture-induced polymeric grating structures

Lin C.C., Yang F., Chin J.W., Sung L., Lee S., National Tsing Hua Univesity, TW

Fracture-induced structure (FIS)1 is found in the polymeric thin film sandwiched between two relatively rigid flat plates by inserting a razor blade at one edge. FIS is a potential candidate to be a low-cost and [...]

Lead Frame Package of MEMS Devices using Wafer-level, Air-gap Structures

Fritz N., Saha R., Bidstrup Allen S.A., Kohl P.A., Georgia Institute of Technology, US

This research looks at using a polymer Air-gap structures as a cost efficient method of wafer and chip level packaging MEMS devices for a wide range of applications. The presentation will describe how this style [...]

Design, Fabrication and Characterization of Inverse Adiabatic Fiber-To-Chip Couplers

Araghchini M., Khilo A., Holzwarth C.W., Dahlem M.S., Smith H.I., Ippen E.P., Kärtner F.X., Massachusetts Institute of Technology, US

In silicon photonics, light sources are typically located off-chip and connected to the chip with optical fibers. The problem of efficient coupling between the fiber and a submicron waveguide is challenging because the mode areas [...]

Tin oxide nanowire sensors for highly sensitive detection of toxic gases

Koeck A., Brunet E., Griessler C., Maier T., Mutinati G., Steinhauer S., AIT Austrian Institute of Technology GmbH, AT

Numerous applications ranging from industrial process control to personal safety systems and environmental monitoring have a strongly increasing demand for highly sensitive gas detecting devices. We present nanosensors based on SnO2-nanowires, which are extremely sensitive [...]

Design and Fabrication of a Multi-Axis MEMS Force Sensor with Integrated Carbon Nanotube Based Piezoresistors

Cullinan M.A., Panas R.M., Culpepper M.L., Massachusetts Institute of Technology, US

Nanonewton level, multi-axis force sensing is required for many biology, materials science and nanomanufacturing applications. Unfortunately, these requirements are difficult to achieve given the size, sensitivity and fabrication limitations associated with existing small-scale sensing techniques. [...]

Space Applications for Wireless Sensors

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

Reducing the weight of spacecraft will reduce both fabrication and launch costs. The elimination of wiring and wiring harnesses reduces the total mass of the vehicle. Wireless sensor technology can reduce the weight and therefore [...]

Programmable MEMS-Based Silicon Timing Solutions Change the Game

Lutz M., SiTime Corp, US

For the past few decades, the electronics industry has relied on quartz based timing solutions, which involve machining of crystals and then marrying them to analog circuits inside an expensive, ceramic package. Furthermore, this package [...]