This paper describes the development of a finite element based MEMPACK code developed by the lead author and his graduate students. The MEMPACK code will be used for simulation and prediction of residual stresses and strains induced in microelectromechanical (MEM) devices during fabrication. It will also be used for the packaging design of MEMS. A case study is presented to illustrate the significant residual stresses and strains induced in a MEM device by a fabrication process.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 82 - 87
Industry sector: Sensors, MEMS, Electronics
Topics: Informatics, Modeling & Simulation, Modeling & Simulation of Microsystems