With an always growing penetration in different mass markets, MEMS are now facing a maturity period, with high constraints for manufacturing simplification and processes standardization in order to lower both costs and time-to-market. In light of these observations, Léti has developed and validated some key enabling technologies allowing to satisfy such manufacturing and cost constraints. This talk will focus on these two specific aspects with: – a description of a generic technology mixing MEMS and NEMS sized parts allowing to manufacture different kinds of MEMS (inertial, pressure, magnetometers…) with a substantial gain in MEMS surface area for an unchanged level of performances. – A presentation of MEMS specific Wafer level packaging technologies leading to significant cost reductions. Specific examples and demonstrators will illustrate the interest of these technologies.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 273 - 277
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications