Korvink J.G., Emmenegger M., Taschini S., Baltes H.
ETH Zürich, CH
Keywords: boundary element method, CMOS, compact model, finite element method, MEMS, model reduction, SPICE
The most appropriate tools for the modelling and simulation of MEMS are strongly related to the technology used to fabricate them. CMOS MEMS are naturally combined with circuitry, and in a packaged form they are capable microsystems. The numerical models of the microsystems therefore have to include the domains and effects of the microsensors, microactuators, the CMOS circuitry and the packaoing. To enable the use of such comprehensive models, we employ compact modelling techniques. The methods are removing the sharp distinction between “lumped” and “continuous” numerical models. This review illustrates recent work we have done in this area.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 5 - 10
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-96661-35-0-3