Rencz M., Székely V., Courtois B.
TIMA-CMP, FR
Keywords: board level thermal simulation tools, packages, RC compact models
The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages, depending on the compact models, is possible. The main advantage is that the methodology keeps the exreme fastness and user friendliness of the board level solvers.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Pages: 612 - 615
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9708275-7-1