wire bonding – TechConnect Briefs

Compliant interconnect technology for power modules in automotive applications

Nenzi P., University of Rome “La Sapienza”, IT

This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

Ramminger S., Mitic G., Türkes P., Wachutka G., Siemens AG, DE

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of [...]

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]