VLSI – TechConnect Briefs

Novel Nanoeletromechanical Switches for VLSI Power Integrity Improvement

Zhang R., Saab D., Masoo M., Case Western Reserve University, US

Complementary Metal Oxide Semiconductor(CMOS)is facing extreme difficulties to realize energy efficient designs while the scaling of channel length has been being at the same pace in the past several decades.In this paper,we presented a novel [...]

A Parallel Intelligent OPC Technique for Design and Fabrication of VLSI Circuit

Yu S-M., Li Y., National Chiao Tung University, TW

Optical lithography is the key technology used in very large scale integrated (VLSI) circuit and systemon- a-chip (SoC) fabrication [1-3]. The exposure on wafer has distortions due to the proximity effects. Hence, a correction of [...]

Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits

Goel A.K., Eady N.R., Michigan Technological University, US

A multipath interconnect carries a signal by using the concept of parallel processing by providing two or more paths between the driver and the load. These paths are stacked vertically isolated from one another by [...]