TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsmodel

Keywords: model

The static behavior of RF MEMS capacitive switches in contact

Suy H.M.R., Herfst R.W., Steeneken P.G., Stulemeijer J., Bielen J.A., NXP Semiconductors Research, NL
A method is presented in which surface topography characterization is combined with the electrical measurement of the contact mechanics under electrostatic loading. Contact characteristics such as the surface separation versus the applied pressure, and the [...]

Body Bias Dependency of Substrate Current and Its Modeling for SOI Devices

Ma Y., Jeng M-C, Liu Z., Cadence Design System, Inc., US
Two competing factors affect the body bias dependence of substrate current in SOI devices. One is through drain current. The other is through electric field in channel near drain side. It is shown that with [...]

Safety, Health, and Environmental Awareness in Nanotechnology Training

Iyuke S.E., University of the Witwastersrand, ZA
The statistical evaluation of the SHE survey strongly supports nine out of the twenty nine test statements to be addressed by practicing nanotechnologists with regards to safety, health and the environment, which are: (1)Sizes, aspect [...]

A Computational Model for the Design of ElectroWetting On Dielectric (EWOD) Systems

Bedekar A.S., Jenkins J.W., Sundaram S., CFD Research Corporation, US
Microfluidics has enabled the development of integrated lab-on-a-chip (LoC) devices for use in a clinical diagnostics, high throughput screening, drug discovery, biodefense and environmental monitoring. Although most microfluidic devices are based on continuous flow of [...]

Interdigitated Low-Loss Ohmic RF-MEMS Switches

Gaddi R., Bellei M., Gnudi A., Margesin B., Giacomozzi F., ARCES - University of Bologna, IT
An interdigitated design for MEMS RF-switches is applied to both a shunt and a series ohmic contact configuration. Interdigitated Al-Ti-TiN RF-signal paths and poly actuation electrodes are arranged underneath an electrodeposited gold plate, suspended by [...]

Compact Modling of High Frequency Phenomena for On-Chip Spiral Inductors

Talwalkar N., Yue P., Wong S., Stanford University, US
This paper presents a physics-based compact model for predicting high frequency performance of spiral inductors. The model accurately accounts for skin effect and proximity effect in the metal conductors as well as eddy current loss [...]

A Modeling Approach based on Laminated Plate Theory to Design Microbeams

Mantell S.C., Longmire E., Wolters D., University of Minnesota, US
MEMs microbeams consist of many thin material layers. This thin layered structure is very similar to that of laminated composite plates in which thin layers of fiber reinforced plastic are stacked and cured. Both the [...]

Microsystem Modeling – from Macromodels to Microsystem Design

Husak M., University of Prague, CZ
The paper presents ideas about possible approaches to development of microsystem models. From the general point of view, microsystem (MST) is considered as a system dealing with non-electrical quantities from all energy domains of real [...]

Biochemical Binding in Microspheres-Based-Imunoassays

Prabhakarpandian B., Shah K.B., Sundaram S., Makhijani V.B., CFD Research Corporation, US
Microspheres (referred commonly as beads) are being extensively used in biochemical assays as supports for proteins, DNA, etc. We have successfully developed |omputational models for simulating sample detection using flowing beads. The model fully integrates [...]

A Model for Fully Depleted Double Gate SOI MOS Transistors Including Temperature Effects

Gharabagi R., St. Louis University, US
A model for a fully depleted double gate Silicon on Insulator (SOI) Metal Oxide Semiconductor (MOS) Transistors is presented. Small geometry effects such carrier velocity saturation, mobility degradation, and channel length modulation are included. Both [...]

Posts pagination

« 1 2 3 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.