Pahl B. – TechConnect Briefs

Micro to Nano – Scaling Packaging Technologies for Future Microsystems

Braun T., Becker K.-F., Bauer J., Hausel F., Pahl B., Wittler O., Mrossko R., Jung E., Ostmann A., Koch M., Bader V., Minge C., Aschenbrenner R., Reichl H., Technical University Berlin, DE

As the development of microelectronics is still driving towards further miniaturization new materials, processes and technologies are crucial for the realization of future cost effective microsystems and components. These future systems will not only consist [...]

Development of a Scalelable Interconnection Technology for Nano Packaging

Becker K.-F., Löher T., Pahl B., Wittler O., Jordan R., Bauer J., Aschenbrenner R., Reichl H., Fraunhofer IZM, DE

Microelectronics miniaturization is following Moore’s law since the mid sixties and over the years it has always been possible to follow it without meeting fundamental technological limits. This might be in question for future applications, [...]