level set method – TechConnect Briefs

Feature Length-Scale Modeling of LPCVD and PECVD MEMS Fabrication Processes

Musson L.C., Ho P., Plimpton S.J., Schmidt R.C., Sandia National Laboratories, US

The surface micromachining processes used to manufacture MEMS devices and integrated circuits transpire at such small length scales and are sufficiently complex that theoretical analysis of them is particularly inviting. Under development at Sandia National [...]

Numerical Simulation of Superconformal Electrodeposition Using the Level Set Method

Wheeler D., Josell D., Moffat T.P., NIST, US

Damascene copper is rapidly replacing aluminum as the interconnect material of choice in silicon technology. The change is driven by the lower electrical resistivity of copper, which decreases power consumption and permits increased central processor [...]

Numerical Simulation of Superconformal Electrodeposition Using the Level Set Method

Wheeler D., Josell D., Moffat T.P., NIST, US

Damascene copper is rapidly replacing aluminum as the interconnect material of choice in silicon technology. The change is driven by the lower electrical resistivity of copper, which decreases power consumption and permits increased central processor [...]

Modeling of Deposition Process by Level Set Method

Jung H., Kwon O., Yoon S., Won T., Inha University, KR

In this paper, we report a novel method for effectively reducing the amount of calculation for a deposition rate at a specific level-set node. The proposed algorithm makes it possible to reduce the number of [...]