electroplating – TechConnect Briefs

Novel Post Treatment of Nano-Particle Reinforced Metallic Coatings

Tay S.L., Goode C., Cirrus Materials Science, NZ

Electrochemical co-deposition of metallic coatings with a second phase material have been widely applied in industry to improve the properties of coatings. A variety of hard oxide, carbide, nitride, and ceramic nanoparticles have been successfully [...]

Iron doped spent tea waste charcoal as potential adsorbent for treatment of electroplating industry waste water

Butt R., Nazir R., Khan M.N., Hamid A., PCSIR, PK

Waste water from electroplating industry is heavily loaded with the heavy metals and is a potential threat to environment and human health. In this study the potentiality of spent tea waste charcoal has been determined [...]

Iron doped spent tea waste charcoal as potential adsorbent for treatment of electroplating industry waste water

Butt R., Nazir R., Khan M.N., Hamid A., PCSIR, PK

Waste water from electroplating industry is heavily loaded with the heavy metals and is a potential threat to environment and human health. In this study the potentiality of spent tea waste charcoal has been determined [...]

Experimental study on sheet resistivity and thickness measurement in Copper Electroplating

Sharma A., Kumar D., Kumar Khandelwal S., Bansal D., Rangra K., Kumar D., Kumar Khandelwal S., Central Electronics Engineering Research Institute (CEERI/ CSIR), IN

Electroplated copper thin films have been extensively used for interconnections in semiconductor devices. In this paper, electroplating of copper has been investigated to study the dependency of plated film thickness, current efficiency and sheet resistivity [...]

Investigation of Metal Nano Layer Formation by the Tunneling Current through the Thin Oxide Film in the Electrolyte–Oxide–Silicon System

Lee S-H., Cheon J-H, Choi S., Choi Y., Choi S., Choi Y., Park Y.J., Seoul National University, KR

In the researches on Electrolyte–Oxide–Silicon (EOS) system, tunneling current through the gate insulator has been considered as an undesirable factor causing reliability issues such as gate insulator degradation and interface state generation. In this work, [...]

Self-assembled monolayer (SAMs) and electroplating process for Cu filling on 32-nm trench

Hong M., Hanyang University, KR

To improve the conformality of Cu seed layer prepared by ELD, we have also developed a novel activation technique by combining a self assembled monolayer (SAM) and Au catalyst. A coupling agent to anchor Au [...]

Crystal-like growth of metal oxide/CNT composite with electroplated “seed”

Kim W-J, Kim Y.H., Jang E.Y., Seo D.K., Kang T.J., Jin K.C., Jeong D.H., Kim W-J, Kim Y.H., Seoul National University, KR

In this study, we developed a novel assembly technique for macroscopic one-dimensional metal oxide/CNT composites. An essential feature of the technique lies in the use of non-aqueous electrolyte in place of the usual aqueous electrolyte [...]

Integrated Microfluidic Device with an Electroplated Palladium Decoupler for Electrochemical Detection of the 8-hydroxydeoxyguanosine (8-OH-dG) DNA Adduct

Dawoud A.A., Kawaguchi T., Jankowiak R., Iowa State University, US

More sensitive and reliable microfluidic devices are needed for the detection of the 8-hydroxy-deoxyguanosine (8-OH-dG) DNA adduct, one of the most frequently used biomarkers reporting on oxidative stress. Therefore, we have developed a capillary electrophoresis [...]

A New Copper Electrodeposition Scheme to Reduce Void Defects after Chemical Mechanical Polishing

Lin J.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW

Deposition of highly (111) oriented conductive layer is required for achieving better electromigration resistance and lower resistivity. Moreover, the amount of void defects decreases as the (111)/(200) ratio increases in CMP process. Hence, we investigated [...]