copper – Page 2 – TechConnect Briefs

An explosive impact technique to nanocrystallize and harden surface of metal materials

Tong S.J., Tong Z., Shi Z.M., Tong S.J., Tong Z., Inner Mongoli University of Technology, CN

An explosive impact surface nanorisation technique (EISNT) was developed to prepare nanostructured surface layers on medium carbon steel (MCS) and pure Copper (PC) plates. The plastic deformation involved the entire plate depth of 4-6 mm, [...]

Copper Displacement Deposition on Nanostructured Porous Silicon

Bandarenka H., Redko S., Nenzi P., Balucani M., Belarusian State University of Informatics and Radioelectronics, BY

In the present work we have demonstrated nanosized structures fabrication by the copper displacement deposition on electrochemically etched porous silicon. Peculiarity of such method is the convergence of copper reduction with porous silicon dissolution. Principal [...]

Rapid Metallization of Silver and Copper Nano Inks by Surface Wave Plasma Sintering

Cho J-M, Lee Y.I., Song Y.A., Kim D-H., Kim S.E., Kim T-H., Kim D-H., Kim S.E., Kim T-H., Kim D-H., Kim S.E., Kim T-H., Samsung Electro-mechanics Co. Ltd., KR

Inkjet printing technique of nano-sized silver or copper particles currently has had lots of attention as an alternative to conventional lithography and etching process for electronic devices in view of reducing costs. The inkjet-printed nano [...]

A new technology for making advanced materials

Varyukhin V., Spuskanyuk V., Davydenko O., Donetsk Institute for Physics and Engineering, National Academy of Sciences of Ukraine, UA

A new combined technology including the equal channel angular hydroextrusion (ECAH), direct hydroextrusion (HE) and drawing (D) techniques for making nanostructure wire is for the first time proposed. The main purpose of our study is [...]

Formation mechanism of copper-silver metal nanoparticle encapsulated in carbon shell

Kang H.Y., Wang H.P., Huang C.H., Tsai C.K., National Cheng Kung University, TW

The formation mechanism of nanosize copper-silver encapsulated in the inert carbon shell (CuAg@C) has been studied by in-situ small angle X-ray scattering (SAXS) spectroscopy. SAXS is a very useful method in studies of electron density [...]

Preparation of Copper-Bearing Nanofluids for Thermal Applications

Velasco A.F., Perales-Perez O.J., Gutiérrez G., University of Puerto Rico, PR

Stable suspension of nanometer solid particles in suitable solvents, so-called nanofluids, has shown enhanced thermal conductivity when compared with the fluid base. This feature enables these suspensions to be considered a promising material for efficient [...]

Broadcast Photonic Curing of Metallic Nanoparticle Films

Schroder K.A., McCool S.C., Furlan W.R., Nanotechnologies, Inc., US

A novel and industrially scalable technique is presented for curing metal nanoparticle based films in which a large area uncured film is made highly conductive by exposure to a brief, intense pulse of light from [...]

Comparison between Nanoindentation and Scratch Test Hardness (Scratch Hardness) Values of Copper Thin Films on Oxidised Silicon Substrates

Chowdhury S., Beegan D., Laugier M.T., University of Alabama at Birmingham, US

We have measured hardness i.e. scratch hardness from the scratch tester usually used for investigating adhesion in thin films and compare this with hardness measured by the nanoindentation technique on copper thin films. We defined [...]

Investigation of the Behaviors of Various Electroplated Copper films during CMP

Feng H.P., Cheng M.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW

The behaviors of various electroplated copper films during CMP are important for removal mechanism and defect generation. This article was to study the characteristics of various copper films during CMP, including impurity effect and current [...]

Investigation of Metal Diffusion into Polymers via ab initio Simulations

Dai L., Yang S.W., Chen X.T., Tan V.B.C., Wu P., National University of Singapore, SG

Ab initio MD simulations were carried out to characterize the diffusion of Cu and Ta atoms/clusters inside an amorphous polymer. The diffusion coefficients of Cu and Ta atoms and their atomic clusters in linear amorphous [...]