ANSYS – TechConnect Briefs

Ion Sources for Biomolecules with Controlled Superposition of Electric and Pneumatic Fields

Hieke A., Ciphergen Biosystems, Inc., US

As previously reported the design of advanced ion sources for collisionaly cooled biomolecules required the development of an advanced multi-physics simulation system GEMIOS (Gas and Electromagnetic Ion Optical Simulator). Recent research based on such GEMIOS [...]

Stress Optimization of a Micromechanical Torsional Spring

Klose T., Kunze D., Sandner T., Schenk H., Lakner H., Schneider A., Schneider P., Schneider A., Schneider P., Fraunhofer IPMS, DE

In this paper we present a method for the design of a stress-optimized, micromechanical torsional spring, used in MEMS. Our optimization approach is based on a software tool for simulator-based optimization MOSCITO, cooperating with the [...]

Design Optimization of a Surface Micromachined Electro-Thermal Beam Flexure Polysilicon Actuator

Atre A., Georgia Institute of Technology, US

Electro-thermal polysilicon actuators are widely employed in optical MEMS applications. These actuators are typically designed for maximum deflection (unloaded) or force (loaded) output characteristics. The optimal design methodology of the actuator has been investigated previously [...]

Design, Modelling and Simulation of a PZN-PT Actuated Micropump

Malleo D., Haas C., Kraft M., University of Southampton, Microelectronics Group, UK

We present an optimization methodology for the design of a self-priming piezoelectrically actuated pump made of a borosilicate glass bonded to silicon. New findings in the design optimization of the piezo-actuated membrane are presented: it [...]

Effect of Thermophysical Property Variations on Surface Micromachined Polysilicon Beam Flexure Actuators

Atre A., Boedo S., Rochester Institute of Technology, US

Electrically heated, thermally driven, surface micromachined polysilicon beam flexure thermal actuators have been investigated using analytical methods that employ constant material properties either taken at room temperature or based on a set of averaged temperatures [...]

Design and Development of an Integrated MEMS Sensor for Real Time Control of Plasma Etching

Morris B.G., May G.S, Georgia Institute of Technology, US

This paper explores a novel technique for monitoring film thickness in reactive ion etching that incorporates a micromachined sensor. The prototype sensor correlates film thickness with the change in resonant frequency that occurs in the [...]

Development of an Advanced Simulation System for the Analysis of Particle Dynamics in LASER based Protein Ion Sources

Hieke A., Ciphergen Biosystems, Inc., US

An advanced multi-physics simulation system henceforth referred to as GEMIOS (Gas and Electromagnetic Ion Optical Simulator) has been implemented which allows the computation of 3D trajectories and energy exchange of ion beams/clouds under the influence [...]

Modeling and Dynamic Simulation of Electrostatically Driven Micromirror

Kweon S., Lee H., Shin H., Samsung Electronics Co.Ltd., US

Dynamic behavior of the electrostatically driven bi-directional micromirror system was simulated with ANSYS parametric design language. The objective of the study is to construct a dynamic simulation scheme for the transient properties of electrostatically coupled [...]

Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells

Hieke A., Infineon Technologies Corporation, US

A fundamental proble of all FEM capacitance computations in MEMS and ULSI is to determine proper mesh size for the elements representing the considered model. In particular, opticaml mesh size selection is crucial for large [...]

Finite-Element Modeling of 3C-SiC Membranes

DeAnna R.G., Mitchell J., Zorman C.A., Mehregany M., U.S. Army Research Laboratory, US

Finite-element modeling (FEM) of 3C-SiC thin-film membranes on Si substrates was used to determine the residual stress and center deflection with applied pressure. The anisotropic, three-dimensional model includes the entire 3C-SiC membrane and Si substrate [...]