Raszkowski T. – TechConnect Briefs

Application of ant colony optimization algorithm to the thermal parameter estimation of modern electronic structures

Raszkowski T., Samson A., Zubert M., Janicki M., Napieralski A., Lodz University of Technology, PL

Modelling of the heat transfer parameters is a very important issue and crucial aspect of the proper operating of every modern electronic structure and device. Therefore, the accurate estimation of all thermal parameters may contribute [...]

3-D Thermal Simulator Dedicated for Modern Silicon Structures

Zubert M., Raszkowski T., Janicki M., Samson A., Jankowski M., Napieralski A., Lodz University of Technology, PL

The accurate thermal modelling of nanoscale chips is of vital importance, as heat dissipation is arguably one of the most important problems in modern integrated circuits. As the technology node is expected to continue to [...]

The Heat transfer in Fin-FET transistor

Zubert M., Janicki M., Raszkowski T., Samson A., Napieralski A., Lodz University of Technology, PL

The electro-thermal analysis is one of the most important development steps in the professional design of analogue submicron electric ICs, power modules design process as well as modern nanostructures. This analysis is useful to power [...]

Modeling of Electromagnetic Phenomena Inside Modern Integrated Semiconductor Structures

Zubert M., Jankowski M., S. Nowak P., Raszkowski T., Samson A., Napieralski A., Lodz University of Technology, PL

The modeling and simulation of electromagnetic phenomena can be useful in modern ICs. This is an important issue, because of the direction of development of new semiconductor technologies. The distance between devices constantly decreases, while [...]