In-Situ Assessment of Wafer-Level Hermeticity by Micromembrane Technique
Yang C.-M., Jung H., Park E.M., Park J.H., Park E.M., Park J.H., Kim H-Y, Lee K-R, National Nano FabCenter, KP
Generally, the quantitative hermeticity of Wafer level Vacuum Packaging (WLVP) has been evaluated by integration of pirani gauge vacuum senses. But, this requires complex fabrication process and higher chip cost. In this work, hermeticity and [...]