TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsJansen R.

Authors: Jansen R.

Micro-Opto-Mechanical Pressure Sensor (MOMPS) in Sin Integrated Photonics Platform

Jansen R., Rochus V., Goyvaerts J., Vandenboch G., van de Voort B., Neutens P., O’Callaghan J., Tilmans H.A.C., Rottenberg X., IMEC, BE
This paper presents a Micro-Opto-Mechanical Pressure Sensor (MOMPS) manufactured in a SiN integrated photonic platform for short wavelength implementation. It implements a single wavelength Mach Zehnder Interferometer (MZI) system allowing a simple readout system. We [...]

Novel Nanoelectromechanical Relay Design Procedure for Logic and Memory Applications

Rottenberg X., Rochus V., Jansen R., Ramezani M., Severi S., Witvrouw A., Tilmans H.A.C., IMEC, BE
NanoElectroMechanical Structures/Systems (NEMS) have been the focus of an increasing attention from researchers in recent years for the alternative they offer to conventional CMOS for application in logics, memory and in general digital circuitry. Scaled [...]

Low Motional Impedance Bulk Acoustic Resonators Based on Metamaterials

Rottenberg X., Jansen R., Rochus V., Figeys B., Nauwelaers B., Tilmans H.A.C., IMEC, BE
This paper presents the implementation of propagating acoustic metamaterials in electrostatically transduced Bulk Acoustic Resonators (BARs) to tune by design their characteristic properties. Novel in this paper is our focus on lowering the observed motional [...]

Passive Temperature-Compensation of MEM Resonators

Rottenberg X., Jansen R., Stoffels S., De Coster J., De Raedt W., De Coster J., De Raedt W., Tilmans H.A.C., IMEC, BE
MEM-resonators are recognized key components for future sensing, wireless and communications applications. Si-based resonators have gained special interest since they offer the perspective to replace bulky quartz resonators on-chip, maintaining high Q-factor and reaching high [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.