Furmanczyk M. – TechConnect Briefs

Coupled System-Level and Physical-Level Simulation

Furmanczyk M., Turowski M., Yu E., Przekwas A.J., CFD Research Corporation, US

Software tools for Mixed-Level Coupled Simulations have been developed. The system-level simulation uses the circuit theory approach, where each element of the system is modeled either through mathematical equation, or through coupling with physical-level 3D [...]

Coupled Multiphysics and Chemistry Simulations of PCR Microreactors with Active Control

Athavale M.M., Chen Z.J., Furmanczyk M., Przekwas A.J., CFD Research Corporation, US

High-fidelity simulation tools that couple fluid flow, heat transfer and chemistry of PCR microreactors have been applied to different microreactor designs. The tools are coupled to a controller software for thermal control of the virtual [...]

CFD-Micromesh: A Fast Geometrical Modeling and Mesh Generation Tool for 3D Microsystem Simulations

Tan Z., Furmanczyk M., Turowski M., Przekwas A.J., CFD Research Corporation, US

In this work, a new fully automated geometrical modeling and meshing tool is described. It imports standard layout formats (CIF, GDSII, DXF), images (GIF, JPG), and 3D boundary representations (STL). A 3D model is then [...]

Reduced Electro-Thermal Models for Integrated Circuits

Furmanczyk M., Napieralski A., Szaniawski K., Tylman W., Lara A., Technical University of Lodz, PL

Power dissipation density in today's integrated circuits makes thermal problems very important. Unfortunately, the electro-thennal co-simulations, which are often indispensable in solving thennal issues, are constrained by the lack of the IC's electro-thermal models. This [...]